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- W3163217759 endingPage "062501" @default.
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- W3163217759 abstract "Direct Cu electroplating on the Co x Ta y layers in an alkaline CuSO 4 -Ethylenediamine (En) solution was carried out and the effects of plating time, plating potential and current density on the film properties were investigated. The electrodeposition mechanism of Cu in CuSO 4 -En solution at different pH values was systematically studied by cyclic voltammetry and electrochemical quartz crystal microgravimetry in combination with UV–visible spectrophotometry. The deposition mechanism of Cu in the electrolyte is closely related to pH value. At pH 5, the predominant reaction is the reduction of Cu 2+ to metallic Cu; at pH 7 and pH 9, the predominant reactions are the reduction of CuEn 2 2+ to metallic Cu. Results also show that increasing plating current density or potential can effectively increase Cu nucleation density on the Co x Ta y . A high nucleation density (about 2.2 × 10 11 cm −2 ) of Cu on Co 1 Ta 1 is obtained. The electroplated Cu film has a relatively strong (111) preferred orientation. These results suggest that the direct Cu electroplating on the Co 1 Ta 1 alloy barrier with higher anti-corrosion than Co in the alkaline solution and high nucleation density provides a new approach for the future Cu interconnect." @default.
- W3163217759 created "2021-05-24" @default.
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- W3163217759 date "2021-06-01" @default.
- W3163217759 modified "2023-10-16" @default.
- W3163217759 title "Electrodeposition of Cu on CoTa Barrier in the Alkaline CuSO<sub>4</sub>-Ethylenediamine Solution" @default.
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- W3163217759 doi "https://doi.org/10.1149/1945-7111/ac0223" @default.
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