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• W3166025183 endingPage "110339" @default.
• W3166025183 startingPage "110339" @default.
• W3166025183 abstract "The Cu-48at.%Cr film was prepared by magnetron co-sputtering deposition technique with working pressure from 0.2 Pa to 1.5 Pa. The microstructure and nanoindentation hardness were investigated. When the working pressure decreased to 0.2 Pa, the consecutive layered structure formed. The formation of layered structure was attributed to the diffusion barrier ability of Cr element and the uphill diffusion of Cu atoms. While at higher working pressure, the sputtering particles energy near the substrate was not enough to promote the Cu diffusion. Therefore, the layered structure became indistinct as the working pressure increased. Owing to the interface strengthen, this layered structure made the nanoindentation hardness increase markedly from 4.2 GPa to 9.3 GPa as the working pressure decreased from 1.5 Pa to 0.2 Pa. This study could provide a good basis for preparing the film with specific microstructure in Cu–Cr system, even in other immiscible systems." @default.
• W3166025183 created "2021-06-22" @default.
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• W3166025183 date "2021-09-01" @default.
• W3166025183 modified "2023-10-16" @default.
• W3166025183 title "Layered structure enhances the hardness of Cu-48at.%Cr film prepared by co-sputtering deposition technique" @default.
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• W3166025183 doi "https://doi.org/10.1016/j.vacuum.2021.110339" @default.
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