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• W3171455853 abstract "This paper presents a single-event burnout (SEB) resistance method for 4H-SiC Junction Barrier Schottky Diode (JBS) under high bias voltage and linear energy transfer (LET) conditions. The method is validated via two-dimensional numerical simulations. The analysis and comparison of conventional 4H-SiC JBS and 4H-SiC Multi-Buffer Layer JBS (MBL-JBS) diodes verify the resistance tolerance of the latter device to SEB. Silvaco TCAD simulation results prove that the 4H-SiC MBL-JBS modulates the drift region's electric field distribution and disperses the high-peak electric field at the N-/N+ junction. Moreover, it reduces the impact generation rate at the Schottky, PN and N-/N+ junctions to achieve SEB tolerance. The device's SEB performance is optimized by adjusting the 4H-SiC MBL-JBS structure parameters, and the SEB threshold voltage is significantly improved compared with the traditional structure." @default.
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• W3171455853 date "2021-01-01" @default.
• W3171455853 modified "2023-09-25" @default.
• W3171455853 title "High Single-Event Burnout Resistance 4H-SiC Junction Barrier Schottky Diode" @default.
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• W3171455853 doi "https://doi.org/10.1109/jeds.2021.3084797" @default.
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