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• W3172092015 abstract "Wide-bandgap (WBG) power devices can tolerate higher currents and voltages than their silicon (Si)-based counterparts. However, the realization of their superior characteristics is tied to the reliability of their packaging, where thermal management and reliable electrical insulation design are the most challenging tasks to this end. Not taking care of the former one leads to thermal runaway, and the latter one causes the electric breakdown of the whole module. In this paper, the packaging design of a 10-kV SiC diode is studied by addressing both challenges above. Electrical insulation design is carried out through a finite element method (FEM) electric field calculation model developed in COMSOL Multiphysics, meeting both the one-minute insulation and PD tests based on IEC 61287–1. Through developing an electrothermal model and for considered dimensions, an accurate estimation of the junction temperature is obtained to determine the maximum load current of the module." @default.
• W3172092015 created "2021-06-22" @default.
• W3172092015 creator A5030877757 @default.
• W3172092015 creator A5066421420 @default.
• W3172092015 date "2020-10-18" @default.
• W3172092015 modified "2023-10-16" @default.
• W3172092015 title "Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging" @default.
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• W3172092015 doi "https://doi.org/10.1109/ceidp49254.2020.9437513" @default.
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