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- W3172757009 abstract "With the development of high-performance electronic equipment, pool boiling heat transfer has attracted great attentions because of its great heat dissipation capability. Although the physical properties of surface like thermal conductivity and wettability could have important influence on pool boiling, their effect has not been systematically studied. In this work, the copper, nickel and copper-nickel porous tablets were prepared by cold pressing method, which were expected to possess different thermal conductivities. Then, the pool boiling curves and the corresponding bubble dynamics of the porous tablets were experimentally investigated. Results turn out that: The thermal conductivity of a sample plays a more important role on boiling heat transfer than the wettability, because a high thermal conductivity always means a reduced activation time of bubble nucleation. When the thermal conductivity is fixed, a high wettability will enhance the boiling heat transfer because of the enlarged bubble-separation frequency. In this experiment, the 2-layered structure combining 1- layer copper and 1-layer nickel could have a maximum HTC of about 2.7 × 104 W/(m2·k), which is about 1.3 (1.47) times that of only 1-layer copper (1-layer nickel) when the same thickness and porosity is applied, because of the high thermal conductivity and wettability." @default.
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- W3172757009 date "2021-12-01" @default.
- W3172757009 modified "2023-10-18" @default.
- W3172757009 title "Effects of thermal conductivity and wettability of porous materials on the boiling heat transfer" @default.
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- W3172757009 doi "https://doi.org/10.1016/j.ijthermalsci.2021.107110" @default.
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