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- W3178954904 abstract "Immersion lithography is becoming a realistic method of high resolution pattern generation for semiconductor manufacturing. Nikon has a roadmap of full-field immersion exposure tools starting with an Engineering Evaluation Tool (EET, NA=0.85), succeeded with production models of S609B (NA=1.07) and S6xx (NA=1.30). EET was constructed in 2004, and is being used for evaluation of immersion technology and process development. With EET, focus, stepping, overlay and across-wafer CD uniformity data are demonstrated to be better or equivalent to dry tools, while the depth of focus (DOF) is significantly improved as expected. A remarkable point is the defectivity result with EET. We have detected no bubbles and a negligible level of “immersion specific” defects even with hydrophobic top coat. A production model S609B will have the NA=1.07 optics, which will be the highest NA of “all refractive optics”, and will be shipped at 2005/4Q. S6xx, with planned shipment timing is 2006/2H, will have NA=1.30 catadioptric optics, whose NA will be the highest NA of “water-immersion”. Both S609B and S6xx will be equipped with loss-less polarized illuminators, which will enable 50nm L/S with S609B and 42nm L/S with S6xx. Resist and top coat are studied from the viewpoints of chemical contamination and scanning properties. Tentative specifications are proposed for leaching of PAG and amines against chemical contamination. As for scanning properties, static contact angle was found to be not a good parameter; instead, sliding angle is proposed." @default.
- W3178954904 created "2021-07-19" @default.
- W3178954904 creator A5001024758 @default.
- W3178954904 creator A5016369044 @default.
- W3178954904 creator A5022492815 @default.
- W3178954904 creator A5063395375 @default.
- W3178954904 creator A5080199518 @default.
- W3178954904 date "2005-05-12" @default.
- W3178954904 modified "2023-09-26" @default.
- W3178954904 title "Full-field exposure tools for immersion lithography" @default.
- W3178954904 cites W2018332578 @default.
- W3178954904 cites W2056423662 @default.
- W3178954904 cites W2090324384 @default.
- W3178954904 doi "https://doi.org/10.1117/12.599352" @default.
- W3178954904 hasPublicationYear "2005" @default.
- W3178954904 type Work @default.
- W3178954904 sameAs 3178954904 @default.
- W3178954904 citedByCount "14" @default.
- W3178954904 crossrefType "proceedings-article" @default.
- W3178954904 hasAuthorship W3178954904A5001024758 @default.
- W3178954904 hasAuthorship W3178954904A5016369044 @default.
- W3178954904 hasAuthorship W3178954904A5022492815 @default.
- W3178954904 hasAuthorship W3178954904A5063395375 @default.
- W3178954904 hasAuthorship W3178954904A5080199518 @default.
- W3178954904 hasConcept C105487726 @default.
- W3178954904 hasConcept C120665830 @default.
- W3178954904 hasConcept C121332964 @default.
- W3178954904 hasConcept C127313418 @default.
- W3178954904 hasConcept C136085584 @default.
- W3178954904 hasConcept C151730666 @default.
- W3178954904 hasConcept C160671074 @default.
- W3178954904 hasConcept C171250308 @default.
- W3178954904 hasConcept C192562407 @default.
- W3178954904 hasConcept C199068039 @default.
- W3178954904 hasConcept C199360897 @default.
- W3178954904 hasConcept C204223013 @default.
- W3178954904 hasConcept C2524010 @default.
- W3178954904 hasConcept C2779227376 @default.
- W3178954904 hasConcept C33923547 @default.
- W3178954904 hasConcept C41008148 @default.
- W3178954904 hasConcept C49040817 @default.
- W3178954904 hasConcept C53524968 @default.
- W3178954904 hasConcept C58097730 @default.
- W3178954904 hasConcept C77928131 @default.
- W3178954904 hasConcept C89002693 @default.
- W3178954904 hasConcept C94263209 @default.
- W3178954904 hasConceptScore W3178954904C105487726 @default.
- W3178954904 hasConceptScore W3178954904C120665830 @default.
- W3178954904 hasConceptScore W3178954904C121332964 @default.
- W3178954904 hasConceptScore W3178954904C127313418 @default.
- W3178954904 hasConceptScore W3178954904C136085584 @default.
- W3178954904 hasConceptScore W3178954904C151730666 @default.
- W3178954904 hasConceptScore W3178954904C160671074 @default.
- W3178954904 hasConceptScore W3178954904C171250308 @default.
- W3178954904 hasConceptScore W3178954904C192562407 @default.
- W3178954904 hasConceptScore W3178954904C199068039 @default.
- W3178954904 hasConceptScore W3178954904C199360897 @default.
- W3178954904 hasConceptScore W3178954904C204223013 @default.
- W3178954904 hasConceptScore W3178954904C2524010 @default.
- W3178954904 hasConceptScore W3178954904C2779227376 @default.
- W3178954904 hasConceptScore W3178954904C33923547 @default.
- W3178954904 hasConceptScore W3178954904C41008148 @default.
- W3178954904 hasConceptScore W3178954904C49040817 @default.
- W3178954904 hasConceptScore W3178954904C53524968 @default.
- W3178954904 hasConceptScore W3178954904C58097730 @default.
- W3178954904 hasConceptScore W3178954904C77928131 @default.
- W3178954904 hasConceptScore W3178954904C89002693 @default.
- W3178954904 hasConceptScore W3178954904C94263209 @default.
- W3178954904 hasLocation W31789549041 @default.
- W3178954904 hasOpenAccess W3178954904 @default.
- W3178954904 hasPrimaryLocation W31789549041 @default.
- W3178954904 hasRelatedWork W1969271420 @default.
- W3178954904 hasRelatedWork W1995841710 @default.
- W3178954904 hasRelatedWork W2014199844 @default.
- W3178954904 hasRelatedWork W2045656844 @default.
- W3178954904 hasRelatedWork W2057628115 @default.
- W3178954904 hasRelatedWork W2058769068 @default.
- W3178954904 hasRelatedWork W2068827449 @default.
- W3178954904 hasRelatedWork W2355550186 @default.
- W3178954904 hasRelatedWork W2373406710 @default.
- W3178954904 hasRelatedWork W2382254464 @default.
- W3178954904 isParatext "false" @default.
- W3178954904 isRetracted "false" @default.
- W3178954904 magId "3178954904" @default.
- W3178954904 workType "article" @default.