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- W3185649635 abstract "Copper electrodeposition from an electrolyte containing a polyether suppressor and chloride exhibits bistable behavior characteristic of s-shaped negative differential (S-NDR) critical systems. The polyether and chloride form a co-adsorbed adlayer on the electrode that inhibits copper electrodeposition by sterically blocking cupric ion from accessing the interface. At sufficiently negative overpotentials, the adlayer is disrupted and copper electrodeposition occurs freely. In cyclic voltammetry (CV) measurements this behavior manifests as large hysteretic windows. The current response is negligible during the forward sweep until potential-dependent breakdown of the suppressor-halide adlayer occurs. The return sweep exhibits elevated current levels until the blocking layer is reformed at potentials 100s of millivolts more positive than the breakdown potential. When operating at a potential within the hysteretic window, and in an electrochemical configuration with sufficient ohmic resistance, copper electrodeposition exhibits bistable, passive – active deposition on the electrode surface. On macroscale planar electrodes this manifests as random Turing patterns whereas on topographically engineered electrodes, common in electronics manufacturing applications, deposition is localized to the most recessed regions of the interface and progresses in a bottom-up manner." @default.
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- W3185649635 date "2021-05-30" @default.
- W3185649635 modified "2023-10-14" @default.
- W3185649635 title "Morphological Evolution of Bistable Copper Electrodeposition during Potentiodynamic and Galvanodynamic Measurements on Microelectrodes" @default.
- W3185649635 doi "https://doi.org/10.1149/ma2021-01481946mtgabs" @default.
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