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- W3189080310 abstract "This paper introduces a non-destructive measurement technique that extracts the as-fabricated substrate height of printed circuit boards. The as-fabricated substrate height is a crucial parameter for dielectric constant extraction and impedance prediction of any fabricated printed circuit board. Multi-measurement and line fitting techniques were introduced to convert measured S-parameters of shorted transmission lines to frequency-dependent per-unit-length inductance. A computation routine used analytical PUL inductance equations to generate frequency-dependent PUL inductance curve with given substrate height. By changing the input substrate height and minimizing the difference between the calculated and measured PUL inductance results, the as-fabricated height was extracted. The obtained height value with associated uncertainty was shown to be consistent with substrate height measured with direct cross-section inspection." @default.
- W3189080310 created "2021-08-16" @default.
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- W3189080310 date "2021-05-10" @default.
- W3189080310 modified "2023-09-27" @default.
- W3189080310 title "Non-destructive PCB Substrate Height Extraction with Multi-Measurement Technique" @default.
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- W3189080310 doi "https://doi.org/10.1109/spi52361.2021.9505208" @default.
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