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- W3190722731 abstract "This paper deals with the packaging of two III-V chips combined to form a System-in-Package (SiP) for RF base transceiver station applications. The first die consists of a high-power amplifier (HPA) and a switch made on GaN-on-SiC. The second one features a low-noise amplifier (LNA) and a driver built on GaAs. Both chips bring together the best of each substrate technology, namely high RF and power performances of GaN, and low-noise capability of GaAs. The SiP was built using fan-out wafer-level packaging (FOWLP) in chip-first face-down configuration. The gap between the chips is as low as $mathrm{100} mumathrm{m}$ . Electrical routing is secured by redistribution layer (RDL) and balls for flip-chip assembly on the PCB. Thermal dissipation has to be managed opposite to the PCB to avoid a too complex PCB design. It is managed by directly contacting the HPA backside with a Cu-liner acting as a heat spreader. This is achieved by opening the molding compound using laser ablation, and subsequently plating Cu on the SiP backside. The SiP has a final size of $mathrm{4}times mathrm{4}times mathrm{0}.mathrm{35} text{mm}^{mathrm{3}}$ , which eventually aims at fitting into the meshing size imposed by an active antenna array operating at 28 GHz. This paper addresses GaN and GaAs chips specific features which have an impact for the FOWLP process flow: low thickness ( $sim mathrm{100} mu mathrm{m}$ ) relative to the targeted $mathrm{350} mumathrm{m}$ -thick molding compound; chips backside coated with Au which shall not be removed; chip frontside with a relatively high topology (almost $mathrm{20} mumathrm{m}$ ). Signal losses were measured in an SiP-like environment at 0.1 dB/mm, 0.2 dB/mm and 0.4 dB/mm respectively at 30 GHz, 40 GHz and 60 GHz. These results are promising in anticipation of the SiP final testing." @default.
- W3190722731 created "2021-08-16" @default.
- W3190722731 creator A5001567947 @default.
- W3190722731 creator A5030228914 @default.
- W3190722731 creator A5031698913 @default.
- W3190722731 creator A5037699779 @default.
- W3190722731 creator A5043087502 @default.
- W3190722731 creator A5044817205 @default.
- W3190722731 creator A5051578442 @default.
- W3190722731 creator A5052522921 @default.
- W3190722731 creator A5070143332 @default.
- W3190722731 creator A5083660567 @default.
- W3190722731 date "2021-06-01" @default.
- W3190722731 modified "2023-09-26" @default.
- W3190722731 title "System in package embedding III-V chips by fan-out wafer-level packaging for RF applications" @default.
- W3190722731 cites W2005653058 @default.
- W3190722731 cites W2101376653 @default.
- W3190722731 cites W2111221847 @default.
- W3190722731 cites W2119607361 @default.
- W3190722731 cites W2147819834 @default.
- W3190722731 cites W2970555124 @default.
- W3190722731 cites W2971326692 @default.
- W3190722731 cites W2991196658 @default.
- W3190722731 cites W3047850524 @default.
- W3190722731 cites W4256423915 @default.
- W3190722731 doi "https://doi.org/10.1109/ectc32696.2021.00318" @default.
- W3190722731 hasPublicationYear "2021" @default.
- W3190722731 type Work @default.
- W3190722731 sameAs 3190722731 @default.
- W3190722731 citedByCount "5" @default.
- W3190722731 countsByYear W31907227312022 @default.
- W3190722731 countsByYear W31907227312023 @default.
- W3190722731 crossrefType "proceedings-article" @default.
- W3190722731 hasAuthorship W3190722731A5001567947 @default.
- W3190722731 hasAuthorship W3190722731A5030228914 @default.
- W3190722731 hasAuthorship W3190722731A5031698913 @default.
- W3190722731 hasAuthorship W3190722731A5037699779 @default.
- W3190722731 hasAuthorship W3190722731A5043087502 @default.
- W3190722731 hasAuthorship W3190722731A5044817205 @default.
- W3190722731 hasAuthorship W3190722731A5051578442 @default.
- W3190722731 hasAuthorship W3190722731A5052522921 @default.
- W3190722731 hasAuthorship W3190722731A5070143332 @default.
- W3190722731 hasAuthorship W3190722731A5083660567 @default.
- W3190722731 hasConcept C119599485 @default.
- W3190722731 hasConcept C126233035 @default.
- W3190722731 hasConcept C127413603 @default.
- W3190722731 hasConcept C146667757 @default.
- W3190722731 hasConcept C154945302 @default.
- W3190722731 hasConcept C160671074 @default.
- W3190722731 hasConcept C165005293 @default.
- W3190722731 hasConcept C186260285 @default.
- W3190722731 hasConcept C192562407 @default.
- W3190722731 hasConcept C24326235 @default.
- W3190722731 hasConcept C2778638305 @default.
- W3190722731 hasConcept C2780288131 @default.
- W3190722731 hasConcept C41008148 @default.
- W3190722731 hasConcept C41608201 @default.
- W3190722731 hasConcept C49040817 @default.
- W3190722731 hasConcept C530198007 @default.
- W3190722731 hasConcept C68812741 @default.
- W3190722731 hasConcept C69567186 @default.
- W3190722731 hasConceptScore W3190722731C119599485 @default.
- W3190722731 hasConceptScore W3190722731C126233035 @default.
- W3190722731 hasConceptScore W3190722731C127413603 @default.
- W3190722731 hasConceptScore W3190722731C146667757 @default.
- W3190722731 hasConceptScore W3190722731C154945302 @default.
- W3190722731 hasConceptScore W3190722731C160671074 @default.
- W3190722731 hasConceptScore W3190722731C165005293 @default.
- W3190722731 hasConceptScore W3190722731C186260285 @default.
- W3190722731 hasConceptScore W3190722731C192562407 @default.
- W3190722731 hasConceptScore W3190722731C24326235 @default.
- W3190722731 hasConceptScore W3190722731C2778638305 @default.
- W3190722731 hasConceptScore W3190722731C2780288131 @default.
- W3190722731 hasConceptScore W3190722731C41008148 @default.
- W3190722731 hasConceptScore W3190722731C41608201 @default.
- W3190722731 hasConceptScore W3190722731C49040817 @default.
- W3190722731 hasConceptScore W3190722731C530198007 @default.
- W3190722731 hasConceptScore W3190722731C68812741 @default.
- W3190722731 hasConceptScore W3190722731C69567186 @default.
- W3190722731 hasFunder F4320327207 @default.
- W3190722731 hasLocation W31907227311 @default.
- W3190722731 hasOpenAccess W3190722731 @default.
- W3190722731 hasPrimaryLocation W31907227311 @default.
- W3190722731 hasRelatedWork W1972607397 @default.
- W3190722731 hasRelatedWork W1993755062 @default.
- W3190722731 hasRelatedWork W2089003336 @default.
- W3190722731 hasRelatedWork W2101376653 @default.
- W3190722731 hasRelatedWork W2148640611 @default.
- W3190722731 hasRelatedWork W2627086168 @default.
- W3190722731 hasRelatedWork W2886857585 @default.
- W3190722731 hasRelatedWork W2904883963 @default.
- W3190722731 hasRelatedWork W3048333717 @default.
- W3190722731 hasRelatedWork W3160806334 @default.
- W3190722731 isParatext "false" @default.
- W3190722731 isRetracted "false" @default.
- W3190722731 magId "3190722731" @default.
- W3190722731 workType "article" @default.