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- W3193262011 abstract "This paper presents a resonant micro-pressure sensor which was vacuum packaged by a glass-on-silicon wafer. The eigenfrequency shifts of two resonators induced under pressure measurements were susceptible to temperature disturbances. The glass-on-silicon wafer packaging can alleviate the side effect of temperature disturbances, and decrease eigenfrequency shifts of resonators. More specifically, the temperature sensitivities were quantified as 37.933 Hz/°C vs. 10.359 Hz/°C with corresponding eigenfrequency shifts measured as 10.2 Hz vs. 2.3 Hz, for the micro-pressure sensor with glass vs. glass-on-silicon packaging. Furthermore, under the pressure scale from 0.05 kPa to 10 kPa and temperature scale from -40 °C to 85 °C, the maximum measurement deviations were reduced from -11.72 Pa to -3.68 Pa with the help of the glass-on-silicon wafer packaging." @default.
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- W3193262011 date "2021-06-20" @default.
- W3193262011 modified "2023-09-23" @default.
- W3193262011 title "A Resonant Micro-Pressure Sensor with Glass-on-Silicon Wafer Packaging" @default.
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- W3193262011 doi "https://doi.org/10.1109/transducers50396.2021.9495626" @default.
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