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• W3193315118 abstract "Phosphinated polyimide (p-PI) with specific amounts of phosphinate diamine has shown improved adhesion strength after hot-pressing to flexible copper clad laminates (FCCL) in previous work. By coupling p-PI with amino-functionalized polydimethylsiloxane (a-PDMS), the adhesion properties of the poly(imide-siloxane) hybrid films (p-PI-Si-w%) were further enhanced. Meanwhile, sufficient mechanical strength and optical transparency of the hybrid films were maintained. The XPS depth profile confirmed the presence of SiC and SiO groups on the surface and consequently increased the surface roughness of p-PI-Si-w% films. Therefore, the peel strength of p-PI-Si-w% significantly increased with a-PDMS content. The low dielectric p-PI-Si-8% film exhibited a peel strength of 0.95 kg/cm and showed a balanced melt-flow condition, which makes it a potential candidate for FCCL processing." @default.
• W3193315118 created "2021-08-30" @default.
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• W3193315118 date "2021-10-01" @default.
• W3193315118 modified "2023-10-17" @default.
• W3193315118 title "Phosphinated poly(imide-siloxane) hybrid films with enhanced adhesion strength and reduced dielectric constant" @default.
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• W3193315118 doi "https://doi.org/10.1016/j.porgcoat.2021.106461" @default.
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