Matches in SemOpenAlex for { <https://semopenalex.org/work/W3194055730> ?p ?o ?g. }
Showing items 1 to 99 of
99
with 100 items per page.
- W3194055730 endingPage "102" @default.
- W3194055730 startingPage "96" @default.
- W3194055730 abstract "Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value." @default.
- W3194055730 created "2021-08-30" @default.
- W3194055730 creator A5010128421 @default.
- W3194055730 creator A5018795881 @default.
- W3194055730 creator A5029747601 @default.
- W3194055730 creator A5050687531 @default.
- W3194055730 creator A5051602418 @default.
- W3194055730 creator A5063205432 @default.
- W3194055730 creator A5077230977 @default.
- W3194055730 date "2021-08-23" @default.
- W3194055730 modified "2023-10-02" @default.
- W3194055730 title "Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate" @default.
- W3194055730 cites W1520724339 @default.
- W3194055730 cites W1554538624 @default.
- W3194055730 cites W1982553332 @default.
- W3194055730 cites W2007413724 @default.
- W3194055730 cites W2032944440 @default.
- W3194055730 cites W2051669310 @default.
- W3194055730 cites W2066617196 @default.
- W3194055730 cites W2107134439 @default.
- W3194055730 cites W2114955730 @default.
- W3194055730 cites W2120512277 @default.
- W3194055730 cites W2170298277 @default.
- W3194055730 cites W2554133965 @default.
- W3194055730 cites W2579702577 @default.
- W3194055730 cites W2773666359 @default.
- W3194055730 cites W2797668093 @default.
- W3194055730 cites W2943767857 @default.
- W3194055730 cites W2956643095 @default.
- W3194055730 doi "https://doi.org/10.1108/ssmt-01-2021-0001" @default.
- W3194055730 hasPublicationYear "2021" @default.
- W3194055730 type Work @default.
- W3194055730 sameAs 3194055730 @default.
- W3194055730 citedByCount "3" @default.
- W3194055730 countsByYear W31940557302022 @default.
- W3194055730 countsByYear W31940557302023 @default.
- W3194055730 crossrefType "journal-article" @default.
- W3194055730 hasAuthorship W3194055730A5010128421 @default.
- W3194055730 hasAuthorship W3194055730A5018795881 @default.
- W3194055730 hasAuthorship W3194055730A5029747601 @default.
- W3194055730 hasAuthorship W3194055730A5050687531 @default.
- W3194055730 hasAuthorship W3194055730A5051602418 @default.
- W3194055730 hasAuthorship W3194055730A5063205432 @default.
- W3194055730 hasAuthorship W3194055730A5077230977 @default.
- W3194055730 hasConcept C111368507 @default.
- W3194055730 hasConcept C127313418 @default.
- W3194055730 hasConcept C127413603 @default.
- W3194055730 hasConcept C134514944 @default.
- W3194055730 hasConcept C13530604 @default.
- W3194055730 hasConcept C147438087 @default.
- W3194055730 hasConcept C159985019 @default.
- W3194055730 hasConcept C191897082 @default.
- W3194055730 hasConcept C192562407 @default.
- W3194055730 hasConcept C19629724 @default.
- W3194055730 hasConcept C26771246 @default.
- W3194055730 hasConcept C2776096463 @default.
- W3194055730 hasConcept C2777289219 @default.
- W3194055730 hasConcept C42360764 @default.
- W3194055730 hasConcept C50296614 @default.
- W3194055730 hasConcept C544778455 @default.
- W3194055730 hasConcept C6556556 @default.
- W3194055730 hasConceptScore W3194055730C111368507 @default.
- W3194055730 hasConceptScore W3194055730C127313418 @default.
- W3194055730 hasConceptScore W3194055730C127413603 @default.
- W3194055730 hasConceptScore W3194055730C134514944 @default.
- W3194055730 hasConceptScore W3194055730C13530604 @default.
- W3194055730 hasConceptScore W3194055730C147438087 @default.
- W3194055730 hasConceptScore W3194055730C159985019 @default.
- W3194055730 hasConceptScore W3194055730C191897082 @default.
- W3194055730 hasConceptScore W3194055730C192562407 @default.
- W3194055730 hasConceptScore W3194055730C19629724 @default.
- W3194055730 hasConceptScore W3194055730C26771246 @default.
- W3194055730 hasConceptScore W3194055730C2776096463 @default.
- W3194055730 hasConceptScore W3194055730C2777289219 @default.
- W3194055730 hasConceptScore W3194055730C42360764 @default.
- W3194055730 hasConceptScore W3194055730C50296614 @default.
- W3194055730 hasConceptScore W3194055730C544778455 @default.
- W3194055730 hasConceptScore W3194055730C6556556 @default.
- W3194055730 hasIssue "2" @default.
- W3194055730 hasLocation W31940557301 @default.
- W3194055730 hasOpenAccess W3194055730 @default.
- W3194055730 hasPrimaryLocation W31940557301 @default.
- W3194055730 hasRelatedWork W1904038266 @default.
- W3194055730 hasRelatedWork W2032944440 @default.
- W3194055730 hasRelatedWork W2091808551 @default.
- W3194055730 hasRelatedWork W2356974673 @default.
- W3194055730 hasRelatedWork W2361742413 @default.
- W3194055730 hasRelatedWork W2511551949 @default.
- W3194055730 hasRelatedWork W2756621888 @default.
- W3194055730 hasRelatedWork W2809290752 @default.
- W3194055730 hasRelatedWork W3194055730 @default.
- W3194055730 hasRelatedWork W4247602312 @default.
- W3194055730 hasVolume "34" @default.
- W3194055730 isParatext "false" @default.
- W3194055730 isRetracted "false" @default.
- W3194055730 magId "3194055730" @default.
- W3194055730 workType "article" @default.