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• W3194822402 abstract "We demonstrate 3D monolithically-stacked IGZO FETs with competitive performance for BEOL circuits. The FETs show excellent switching electrostatics with near-deal subthreshold swing, ultra-low leakage density (~10-6 A/cm2) and superior electron mobility (μ eff = 57 cm2/V-s). The device fabrication are achieved at low-temperatures (T≤350°C), making the process highly compatible with low-thermal budget Cu interconnect. We have enabled body-contacted IGZO FETs, capable of dynamic body biasing and implemented these devices into functional novel circuits. We show the feasibility of stacking these FETs with little performance impact." @default.
• W3194822402 created "2021-08-30" @default.
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• W3194822402 date "2021-06-13" @default.
• W3194822402 modified "2023-09-23" @default.
• W3194822402 title "2-kbit Array of 3-D Monolithically-stacked IGZO FETs with Low SS-64mV/dec, Ultra-low-leakage, Competitive μ-57 cm 2 /V-s Performance and Novel nMOS-Only Circuit Demonstration" @default.
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