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- W3196462014 abstract "The Cu-clad PPTA fibers ([email protected]), which combined conductive coating with high-performance fibers, have been successfully prepared through a simple and controllable chemical copper deposition process. Chemical phase analysis indicated that carboxyl group was successfully obtained by breaking amide bond via ultrasonic etching (UE), and Pd element after sensitization and activation was adsorbed on the surface of PPTA fibers, and the catalytic palladium accounted for 50 at%. Moreover, it was also confirmed that the state of metal coating was pure metal. Microstructure characterization demonstrated that the nanoscale cracks were achieved after UE treatment and the copper nanoparticles were nearly spherical but irregular in shape. Additionally, the growth of copper crystal was nonlinear, and the formation of copper film might be controlled by capillary force. The possible formation mechanism of copper film on the surface of PPTA fibers was proposed, including nucleation stage, planar growth stage and multiplanar growth stage." @default.
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- W3196462014 date "2021-06-01" @default.
- W3196462014 modified "2023-10-01" @default.
- W3196462014 title "Unraveling the multilayer structure formation mechanism of copper coating for the metallization of poly para-phenylene terephthalamide fibers" @default.
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- W3196462014 doi "https://doi.org/10.1016/j.colsurfa.2021.126450" @default.
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