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- W3196522692 abstract "Liquid metals and alloys with high-aspect-ratio nanodimensional features are highly sought-after for emerging electronic applications. However, high surface tension, water-like fluidity, and the existence of self-limiting oxides confer specific peculiarities to their characteristics. Here, we introduce a high accuracy nanometric three-dimensional pulling and stretching method to fabricate liquid-metal-based nanotips from room- or near-room-temperature gallium-based alloys. The pulling rate and step size were controlled with a resolution of up to 10 nm and yielded different nanotip morphologies and lengths as a function of the base liquid metal alloy composition and the pulling parameters. The obtained nanotips presented high aspect ratios over lengths of a few microns and apexes between 10 and 100 nm. The liquid metal alloys were found confined within nanotips with about 10 nm apexes when vertically pulled at 100 nm/s. An amorphous gallium oxide skin was shown to cover the surface of the nanotips, while the liquid core was composed of the initial liquid metal alloys. The electrical contact established at the nanotips was characterized under dynamic conditions. The liquid metal nanotips showed an Ohmic resistance when a continuous liquid metal channel was formed, and a controllable semiconductor state corresponding to a heterojunction formed at the junction between the liquid metal phase and the gallium oxide semiconductor skin. The variable threshold voltages of the heterojunction were controlled via stretching of the nanotips with a 10 nm step resolution. The liquid metal nanotips were also used for establishing soft electronic junctions. This novel method of liquid metal nanotip fabrication with Ohmic and semiconducting behaviors will lead to exciting avenues for developing electronic and sensing devices." @default.
- W3196522692 created "2021-09-13" @default.
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- W3196522692 date "2021-08-30" @default.
- W3196522692 modified "2023-10-18" @default.
- W3196522692 title "Nanotip Formation from Liquid Metals for Soft Electronic Junctions" @default.
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- W3196522692 doi "https://doi.org/10.1021/acsami.1c11213" @default.
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