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• W3197187035 endingPage "1369" @default.
• W3197187035 startingPage "1369" @default.
• W3197187035 abstract "In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu2+ and O2 is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu2+ concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu2+ and O2 to the leachant in comparison with the addition of O2 or both Cu2+ and N2 in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O2 flow rate, and initial Cu2+ concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu2+ concentration, 10,000 mg/L; and O2 flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu2+ and O2 as a mild leach medium without strong oxidants such as HNO3, H2O2, and Fe3+ is valid for Cu leaching from PCBs." @default.
• W3197187035 created "2021-09-13" @default.
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• W3197187035 date "2021-08-30" @default.
• W3197187035 modified "2023-10-10" @default.
• W3197187035 title "Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen" @default.
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• W3197187035 doi "https://doi.org/10.3390/met11091369" @default.
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