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- W3198380385 abstract "Sn-Ag-Cu lead-free solder alloy containing nanoparticles has been extensively developed as replacement for the conventional tin-lead (Sn-Pb) solder in electronic packaging industry. Sn-Ag-Cu solder alloy has been receiving a lot of attention with its good reliability and mechanical properties. Addition of nanoparticles in Sn-Ag-Cu solder with appropriate content provides remarkable improvements on the properties of Sn-Ag-Cu solder. Thus, this paper reviews the effects of addition of nanoparticles on the properties of Sn-Ag-Cu lead free solder alloy." @default.
- W3198380385 created "2021-09-13" @default.
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- W3198380385 date "2021-01-01" @default.
- W3198380385 modified "2023-09-23" @default.
- W3198380385 title "A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy" @default.
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- W3198380385 doi "https://doi.org/10.1063/5.0052172" @default.
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