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• W3201561646 endingPage "979" @default.
• W3201561646 startingPage "968" @default.
• W3201561646 abstract "Close integration of transducer arrays with supporting electronic circuits is essential in achieving efficient and compact ultrasound systems. An integral part of hybrid integration of 2D CMUT array to CMOS electronics is the introduction of through-glass-via (TGV) interconnects in glass substrates as an integral part of the 2D CMUT array fabrication. Micro-cracks around via locations, via discontinuity, and poor coplanarity between the vias and glass substrate are some of the challenges with laser-drilled, paste-filled copper-through-glass-via (Cu-TGV) interconnects. This study provides a detailed fabrication process for making <inline-formula xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink> <tex-math notation=LaTeX>$32times 32$ </tex-math></inline-formula> -element 2D CMUT arrays on a composite glass substrate incorporating silicon-through-glass vias (Si-TGV) as interconnects using sacrificial release approach. On one column of a fabricated 2D CMUT array, we measured a mean resonant frequency of 5.6 MHz in air and an average device capacitance of 1.5 pF. With the introduction of a buried top electrode in the device structure, we achieved a collapse voltage of 93 V, which is considerably lower than the collapse voltage measured in our previously demonstrated 2D CMUT arrays with top electrode on top of the nitride plate. The fabricated array is flip-chip bonded on a custom-designed driving integrated circuit to demonstrate the complete system operation. We measured a peak-to-peak pressure of 1.82 MPa at 3.4 MHz, and 5 mm from the array surface in a 0.33 mm focal spot size. [2021-0101]" @default.
• W3201561646 created "2021-09-27" @default.
• W3201561646 creator A5005464045 @default.
• W3201561646 creator A5009868880 @default.
• W3201561646 creator A5037709982 @default.
• W3201561646 creator A5042767667 @default.
• W3201561646 creator A5045267918 @default.
• W3201561646 creator A5050162840 @default.
• W3201561646 creator A5062533009 @default.
• W3201561646 date "2021-12-01" @default.
• W3201561646 modified "2023-09-27" @default.
• W3201561646 title "Fabrication of 32 × 32 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Sacrificial Release Process" @default.
• W3201561646 cites W1984204431 @default.
• W3201561646 cites W2013191230 @default.
• W3201561646 cites W2044322577 @default.
• W3201561646 cites W2067053840 @default.
• W3201561646 cites W2079357440 @default.
• W3201561646 cites W2081206668 @default.
• W3201561646 cites W2085742149 @default.
• W3201561646 cites W2086956498 @default.
• W3201561646 cites W2110663271 @default.
• W3201561646 cites W2118086195 @default.
• W3201561646 cites W2131372568 @default.
• W3201561646 cites W2134863019 @default.
• W3201561646 cites W2136642012 @default.
• W3201561646 cites W2137562317 @default.
• W3201561646 cites W2138107098 @default.
• W3201561646 cites W2142967648 @default.
• W3201561646 cites W2143914153 @default.
• W3201561646 cites W2157268614 @default.
• W3201561646 cites W2161377943 @default.
• W3201561646 cites W2164492047 @default.
• W3201561646 cites W2344710050 @default.
• W3201561646 cites W2564397219 @default.
• W3201561646 cites W3023501433 @default.
• W3201561646 cites W3104229218 @default.
• W3201561646 doi "https://doi.org/10.1109/jmems.2021.3111304" @default.
• W3201561646 hasPublicationYear "2021" @default.
• W3201561646 type Work @default.
• W3201561646 sameAs 3201561646 @default.
• W3201561646 citedByCount "1" @default.
• W3201561646 countsByYear W32015616462023 @default.
• W3201561646 crossrefType "journal-article" @default.
• W3201561646 hasAuthorship W3201561646A5005464045 @default.
• W3201561646 hasAuthorship W3201561646A5009868880 @default.
• W3201561646 hasAuthorship W3201561646A5037709982 @default.
• W3201561646 hasAuthorship W3201561646A5042767667 @default.
• W3201561646 hasAuthorship W3201561646A5045267918 @default.
• W3201561646 hasAuthorship W3201561646A5050162840 @default.
• W3201561646 hasAuthorship W3201561646A5062533009 @default.
• W3201561646 hasConcept C100082104 @default.
• W3201561646 hasConcept C111368507 @default.
• W3201561646 hasConcept C119599485 @default.
• W3201561646 hasConcept C121332964 @default.
• W3201561646 hasConcept C127313418 @default.
• W3201561646 hasConcept C127413603 @default.
• W3201561646 hasConcept C136525101 @default.
• W3201561646 hasConcept C142724271 @default.
• W3201561646 hasConcept C145667562 @default.
• W3201561646 hasConcept C147789679 @default.
• W3201561646 hasConcept C159985019 @default.
• W3201561646 hasConcept C160671074 @default.
• W3201561646 hasConcept C17525397 @default.
• W3201561646 hasConcept C185592680 @default.
• W3201561646 hasConcept C192562407 @default.
• W3201561646 hasConcept C204787440 @default.
• W3201561646 hasConcept C206755178 @default.
• W3201561646 hasConcept C206802598 @default.
• W3201561646 hasConcept C24890656 @default.
• W3201561646 hasConcept C2777289219 @default.
• W3201561646 hasConcept C30066665 @default.
• W3201561646 hasConcept C49040817 @default.
• W3201561646 hasConcept C530198007 @default.
• W3201561646 hasConcept C56318395 @default.
• W3201561646 hasConcept C58772458 @default.
• W3201561646 hasConcept C71924100 @default.
• W3201561646 hasConcept C81288441 @default.
• W3201561646 hasConceptScore W3201561646C100082104 @default.
• W3201561646 hasConceptScore W3201561646C111368507 @default.
• W3201561646 hasConceptScore W3201561646C119599485 @default.
• W3201561646 hasConceptScore W3201561646C121332964 @default.
• W3201561646 hasConceptScore W3201561646C127313418 @default.
• W3201561646 hasConceptScore W3201561646C127413603 @default.
• W3201561646 hasConceptScore W3201561646C136525101 @default.
• W3201561646 hasConceptScore W3201561646C142724271 @default.
• W3201561646 hasConceptScore W3201561646C145667562 @default.
• W3201561646 hasConceptScore W3201561646C147789679 @default.
• W3201561646 hasConceptScore W3201561646C159985019 @default.
• W3201561646 hasConceptScore W3201561646C160671074 @default.
• W3201561646 hasConceptScore W3201561646C17525397 @default.
• W3201561646 hasConceptScore W3201561646C185592680 @default.
• W3201561646 hasConceptScore W3201561646C192562407 @default.
• W3201561646 hasConceptScore W3201561646C204787440 @default.
• W3201561646 hasConceptScore W3201561646C206755178 @default.
• W3201561646 hasConceptScore W3201561646C206802598 @default.
• W3201561646 hasConceptScore W3201561646C24890656 @default.
• W3201561646 hasConceptScore W3201561646C2777289219 @default.
• W3201561646 hasConceptScore W3201561646C30066665 @default.

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