FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3201638566> ?p ?o ?g. }

• W3201638566 endingPage "8403" @default.
• W3201638566 startingPage "8403" @default.
• W3201638566 abstract "Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films with an equivalent thickness between 6 and 22 nm, measured by exploiting the K-ratio method with SEM-EDS of Pd layers. The Pd films obtained in this step of the work represent a cost-effective catalytic substrate. As a second step, we selected chemical plating as the procedure to obtain palladium films with a thickness in the micrometre range. An ammonia-based Pd chemical plating bath represent one of the most effective chemical plating formulations. To prevent copper substrates from being damaged by ammonia, displacement plating with palladium was also applied as a pre-treatment to make the use of these plating baths a viable way to obtain thicker palladium coatings. Palladium films showing good adherence, compact morphology, and a thickness over 1.5 μm were obtained, proving that the combination of two different electroless techniques was the key to develop a sustainable procedure for micrometre-sized palladium coatings, which could substitute electroplating of Pd in galvanic industry for decorative applications." @default.
• W3201638566 created "2021-09-27" @default.
• W3201638566 creator A5010200401 @default.
• W3201638566 creator A5020516490 @default.
• W3201638566 creator A5038557702 @default.
• W3201638566 creator A5041024256 @default.
• W3201638566 creator A5050843808 @default.
• W3201638566 creator A5059239934 @default.
• W3201638566 creator A5076418115 @default.
• W3201638566 creator A5081526841 @default.
• W3201638566 date "2021-09-10" @default.
• W3201638566 modified "2023-09-26" @default.
• W3201638566 title "Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper" @default.
• W3201638566 cites W1590427390 @default.
• W3201638566 cites W1976501858 @default.
• W3201638566 cites W1989989548 @default.
• W3201638566 cites W1995572087 @default.
• W3201638566 cites W2002323948 @default.
• W3201638566 cites W2018101740 @default.
• W3201638566 cites W2020174225 @default.
• W3201638566 cites W2020814722 @default.
• W3201638566 cites W2025275789 @default.
• W3201638566 cites W2026304195 @default.
• W3201638566 cites W2035486233 @default.
• W3201638566 cites W2035871952 @default.
• W3201638566 cites W2037275354 @default.
• W3201638566 cites W2044052747 @default.
• W3201638566 cites W2048537362 @default.
• W3201638566 cites W2068102197 @default.
• W3201638566 cites W2076909595 @default.
• W3201638566 cites W2084762088 @default.
• W3201638566 cites W2089710907 @default.
• W3201638566 cites W2108913330 @default.
• W3201638566 cites W2112340203 @default.
• W3201638566 cites W2112636951 @default.
• W3201638566 cites W2124273677 @default.
• W3201638566 cites W2133105275 @default.
• W3201638566 cites W2139481148 @default.
• W3201638566 cites W2246351137 @default.
• W3201638566 cites W2321089945 @default.
• W3201638566 cites W2331269619 @default.
• W3201638566 cites W2346268425 @default.
• W3201638566 cites W2479018181 @default.
• W3201638566 cites W2493481972 @default.
• W3201638566 cites W2497222860 @default.
• W3201638566 cites W2509720275 @default.
• W3201638566 cites W2606757208 @default.
• W3201638566 cites W2789517172 @default.
• W3201638566 cites W2792326223 @default.
• W3201638566 cites W2884746992 @default.
• W3201638566 cites W2912073293 @default.
• W3201638566 cites W3045614211 @default.
• W3201638566 cites W3112647779 @default.
• W3201638566 cites W3114569054 @default.
• W3201638566 cites W3118562094 @default.
• W3201638566 cites W3119789537 @default.
• W3201638566 cites W220275744 @default.
• W3201638566 doi "https://doi.org/10.3390/app11188403" @default.
• W3201638566 hasPublicationYear "2021" @default.
• W3201638566 type Work @default.
• W3201638566 sameAs 3201638566 @default.
• W3201638566 citedByCount "2" @default.
• W3201638566 countsByYear W32016385662022 @default.
• W3201638566 countsByYear W32016385662023 @default.
• W3201638566 crossrefType "journal-article" @default.
• W3201638566 hasAuthorship W3201638566A5010200401 @default.
• W3201638566 hasAuthorship W3201638566A5020516490 @default.
• W3201638566 hasAuthorship W3201638566A5038557702 @default.
• W3201638566 hasAuthorship W3201638566A5041024256 @default.
• W3201638566 hasAuthorship W3201638566A5050843808 @default.
• W3201638566 hasAuthorship W3201638566A5059239934 @default.
• W3201638566 hasAuthorship W3201638566A5076418115 @default.
• W3201638566 hasAuthorship W3201638566A5081526841 @default.
• W3201638566 hasBestOaLocation W32016385661 @default.
• W3201638566 hasConcept C111368507 @default.
• W3201638566 hasConcept C127313418 @default.
• W3201638566 hasConcept C127413603 @default.
• W3201638566 hasConcept C151730666 @default.
• W3201638566 hasConcept C159985019 @default.
• W3201638566 hasConcept C161790260 @default.
• W3201638566 hasConcept C171250308 @default.
• W3201638566 hasConcept C185592680 @default.
• W3201638566 hasConcept C191897082 @default.
• W3201638566 hasConcept C192562407 @default.
• W3201638566 hasConcept C2776985018 @default.
• W3201638566 hasConcept C2777289219 @default.
• W3201638566 hasConcept C2779227376 @default.
• W3201638566 hasConcept C2816523 @default.
• W3201638566 hasConcept C29216876 @default.
• W3201638566 hasConcept C29633239 @default.
• W3201638566 hasConcept C42360764 @default.
• W3201638566 hasConcept C502130503 @default.
• W3201638566 hasConcept C51807945 @default.
• W3201638566 hasConcept C544778455 @default.
• W3201638566 hasConcept C55493867 @default.
• W3201638566 hasConcept C64297162 @default.
• W3201638566 hasConcept C70862543 @default.
• W3201638566 hasConcept C77066764 @default.

• next