FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3206559893> ?p ?o ?g. }

• W3206559893 endingPage "3633" @default.
• W3206559893 startingPage "3633" @default.
• W3206559893 abstract "Divinylsiloxane-bis-benzocyclobutene (DVS-BCB) has attracted significant attention as an intermediate bonding material, owing to its excellent properties. However, its applications are limited, due to damage to peripheral devices at high curing temperatures and unoptimized compressive pressure. Therefore, it is necessary to explore the compressive pressure condition for DVS-BCB bonding. This study demonstrates an optimization process for void-free DVS-BCB bonding. The process for obtaining void-free DVS-BCB bonding is a vacuum condition of 0.03 Torr, compressive pressure of 0.6 N/mm2, and curing temperature of 250 °C for 1 h. Herein, we define two factors affecting the DVS-BCB bonding quality through the DVS-BCB bonding mechanism. For strong DVS-BCB bonding, void-free and high-density chemical bonds are required. Therefore, we observed the DVS-BCB bonding under various compressive pressure conditions at a relatively low temperature (250 °C). The presence of voids and high-density crosslinking density was examined through near-infrared confocal laser microscopy and Fourier-transform infrared microscopy. We also evaluated the adhesion of the DVS-BCB bonding, using a universal testing machine. The results suggest that the good adhesion with no voids and high crosslinking density was obtained at the compressive pressure condition of 0.6 N/mm2. We believe that the proposed process will be of great significance for applications in semiconductor and device packaging technologies." @default.
• W3206559893 created "2021-10-25" @default.
• W3206559893 creator A5016021921 @default.
• W3206559893 creator A5034207880 @default.
• W3206559893 creator A5056668260 @default.
• W3206559893 creator A5068739454 @default.
• W3206559893 creator A5079592356 @default.
• W3206559893 date "2021-10-21" @default.
• W3206559893 modified "2023-10-15" @default.
• W3206559893 title "High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process" @default.
• W3206559893 cites W1766534889 @default.
• W3206559893 cites W1980631841 @default.
• W3206559893 cites W1984217894 @default.
• W3206559893 cites W2012652243 @default.
• W3206559893 cites W2016478790 @default.
• W3206559893 cites W2016686907 @default.
• W3206559893 cites W2022120785 @default.
• W3206559893 cites W2024354450 @default.
• W3206559893 cites W2024457277 @default.
• W3206559893 cites W2027516477 @default.
• W3206559893 cites W2029637008 @default.
• W3206559893 cites W2034158139 @default.
• W3206559893 cites W2040946508 @default.
• W3206559893 cites W2048739617 @default.
• W3206559893 cites W2055333160 @default.
• W3206559893 cites W2056828898 @default.
• W3206559893 cites W2114353543 @default.
• W3206559893 cites W2127244771 @default.
• W3206559893 cites W2127719701 @default.
• W3206559893 cites W2143957817 @default.
• W3206559893 cites W2163169083 @default.
• W3206559893 cites W2250666512 @default.
• W3206559893 cites W2346578233 @default.
• W3206559893 cites W2346655264 @default.
• W3206559893 cites W2493925267 @default.
• W3206559893 cites W2516637973 @default.
• W3206559893 cites W2596965710 @default.
• W3206559893 cites W2770454303 @default.
• W3206559893 cites W2973192809 @default.
• W3206559893 cites W2991083356 @default.
• W3206559893 cites W3006605765 @default.
• W3206559893 cites W3081676008 @default.
• W3206559893 cites W3088374259 @default.
• W3206559893 cites W3088805900 @default.
• W3206559893 cites W3168776220 @default.
• W3206559893 cites W2023578049 @default.
• W3206559893 doi "https://doi.org/10.3390/polym13213633" @default.
• W3206559893 hasPubMedCentralId "https://www.ncbi.nlm.nih.gov/pmc/articles/8588381" @default.
• W3206559893 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/34771189" @default.
• W3206559893 hasPublicationYear "2021" @default.
• W3206559893 type Work @default.
• W3206559893 sameAs 3206559893 @default.
• W3206559893 citedByCount "3" @default.
• W3206559893 countsByYear W32065598932022 @default.
• W3206559893 countsByYear W32065598932023 @default.
• W3206559893 crossrefType "journal-article" @default.
• W3206559893 hasAuthorship W3206559893A5016021921 @default.
• W3206559893 hasAuthorship W3206559893A5034207880 @default.
• W3206559893 hasAuthorship W3206559893A5056668260 @default.
• W3206559893 hasAuthorship W3206559893A5068739454 @default.
• W3206559893 hasAuthorship W3206559893A5079592356 @default.
• W3206559893 hasBestOaLocation W32065598931 @default.
• W3206559893 hasConcept C121332964 @default.
• W3206559893 hasConcept C132976073 @default.
• W3206559893 hasConcept C138113353 @default.
• W3206559893 hasConcept C159985019 @default.
• W3206559893 hasConcept C180088628 @default.
• W3206559893 hasConcept C192562407 @default.
• W3206559893 hasConcept C2776366733 @default.
• W3206559893 hasConcept C2779772531 @default.
• W3206559893 hasConcept C30407753 @default.
• W3206559893 hasConcept C30646810 @default.
• W3206559893 hasConcept C521977710 @default.
• W3206559893 hasConcept C97355855 @default.
• W3206559893 hasConceptScore W3206559893C121332964 @default.
• W3206559893 hasConceptScore W3206559893C132976073 @default.
• W3206559893 hasConceptScore W3206559893C138113353 @default.
• W3206559893 hasConceptScore W3206559893C159985019 @default.
• W3206559893 hasConceptScore W3206559893C180088628 @default.
• W3206559893 hasConceptScore W3206559893C192562407 @default.
• W3206559893 hasConceptScore W3206559893C2776366733 @default.
• W3206559893 hasConceptScore W3206559893C2779772531 @default.
• W3206559893 hasConceptScore W3206559893C30407753 @default.
• W3206559893 hasConceptScore W3206559893C30646810 @default.
• W3206559893 hasConceptScore W3206559893C521977710 @default.
• W3206559893 hasConceptScore W3206559893C97355855 @default.
• W3206559893 hasFunder F4320321681 @default.
• W3206559893 hasFunder F4320322120 @default.
• W3206559893 hasIssue "21" @default.
• W3206559893 hasLocation W32065598931 @default.
• W3206559893 hasLocation W32065598932 @default.
• W3206559893 hasLocation W32065598933 @default.
• W3206559893 hasLocation W32065598934 @default.
• W3206559893 hasOpenAccess W3206559893 @default.
• W3206559893 hasPrimaryLocation W32065598931 @default.
• W3206559893 hasRelatedWork W1968519399 @default.
• W3206559893 hasRelatedWork W2067097764 @default.
• W3206559893 hasRelatedWork W2076214759 @default.

• next