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- W3208064971 abstract "The thermal interface materials (TIMs) used between a chip and a heat spreader in electronic packaging composes polymeric materials filled with particulate fillers. In this work, we focus on the numerical modeling and design of the particle-laden polymers with high packing density, in which two kinds of particles are mixed. Specifically, <tex xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>$mathbf{mathrm{A}1_{2}mathrm{O}_{3}}$</tex> and AIN, which are commonly used in the electronic packaging industry, are taken as the particulate fillers. Firstly, a series of microstructures of Al <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</inf> O <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> / AIN filled polymer composites with 75 vol% filler volume fraction are generated in GeoDict software with changing the relative content of Al <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</inf> O <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> and AIN. The diameters of the Al <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</inf> O <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> and AIN particles obey orthogonal logarithmic distribution and Gaussian distribution, respectively. Then the thermal conductivities of the structures are simulated under various microscopic factors, such as particle-particle and particle-matrix interfacial thermal resistance, etc. The results are analyzed taken advantage of the orthogonal experimental design, showing that the particle-particle interfacial thermal resistance plays dominant role in the thermal properties of the particulate composites. We demonstrate that such technique can be used to optimize the design of particulate TIMs." @default.
- W3208064971 created "2021-11-08" @default.
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- W3208064971 date "2021-09-14" @default.
- W3208064971 modified "2023-09-26" @default.
- W3208064971 title "Numerical analysis of the microscopic factors influencing the thermal conductivity of Al<sub>2</sub>O<sub>3</sub>/ AIN polymer composites" @default.
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- W3208064971 doi "https://doi.org/10.1109/icept52650.2021.9568154" @default.
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