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- W3208351373 abstract "As the semiconductor devices are getting higher frequency, higher power and smaller size, the management of thermal dissipation becomes a big challenge. The application of diamond as heat dissipation substrate for high-power semiconductor devices has been placed great expectation due to its ultra-high thermal conductivity. In this study, Au thin layer was used for the low temperature bonding of polycrystalline diamond and Si. The Au-Au atomic diffusion bonding was successfully achieved. Clean processes were optimized. Scanning acoustic microscope (SAM) was used to determine the bonding porosity, which typically exceeded 10%. Atomic force microscope (AFM) tests indicated the diamond surface roughness (Ra>1nm). The poor surface flatness of diamond contributed to the degradation of bond-ability. The technological route of diamond heat dissipation substrate for high-power semiconductor devices needs more optimization." @default.
- W3208351373 created "2021-11-08" @default.
- W3208351373 creator A5025693611 @default.
- W3208351373 creator A5057978069 @default.
- W3208351373 creator A5060840215 @default.
- W3208351373 creator A5083892286 @default.
- W3208351373 creator A5087014857 @default.
- W3208351373 date "2021-09-14" @default.
- W3208351373 modified "2023-10-16" @default.
- W3208351373 title "Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices" @default.
- W3208351373 cites W1977747200 @default.
- W3208351373 cites W1983994459 @default.
- W3208351373 cites W2077048186 @default.
- W3208351373 cites W2196876730 @default.
- W3208351373 cites W2991023855 @default.
- W3208351373 cites W3015307764 @default.
- W3208351373 cites W3018344073 @default.
- W3208351373 doi "https://doi.org/10.1109/icept52650.2021.9568004" @default.
- W3208351373 hasPublicationYear "2021" @default.
- W3208351373 type Work @default.
- W3208351373 sameAs 3208351373 @default.
- W3208351373 citedByCount "0" @default.
- W3208351373 crossrefType "proceedings-article" @default.
- W3208351373 hasAuthorship W3208351373A5025693611 @default.
- W3208351373 hasAuthorship W3208351373A5057978069 @default.
- W3208351373 hasAuthorship W3208351373A5060840215 @default.
- W3208351373 hasAuthorship W3208351373A5083892286 @default.
- W3208351373 hasAuthorship W3208351373A5087014857 @default.
- W3208351373 hasConcept C107365816 @default.
- W3208351373 hasConcept C108225325 @default.
- W3208351373 hasConcept C111368507 @default.
- W3208351373 hasConcept C127313418 @default.
- W3208351373 hasConcept C159985019 @default.
- W3208351373 hasConcept C171250308 @default.
- W3208351373 hasConcept C192562407 @default.
- W3208351373 hasConcept C2776921476 @default.
- W3208351373 hasConcept C2777289219 @default.
- W3208351373 hasConcept C2779227376 @default.
- W3208351373 hasConcept C49040817 @default.
- W3208351373 hasConcept C71039073 @default.
- W3208351373 hasConcept C79635011 @default.
- W3208351373 hasConcept C97346530 @default.
- W3208351373 hasConceptScore W3208351373C107365816 @default.
- W3208351373 hasConceptScore W3208351373C108225325 @default.
- W3208351373 hasConceptScore W3208351373C111368507 @default.
- W3208351373 hasConceptScore W3208351373C127313418 @default.
- W3208351373 hasConceptScore W3208351373C159985019 @default.
- W3208351373 hasConceptScore W3208351373C171250308 @default.
- W3208351373 hasConceptScore W3208351373C192562407 @default.
- W3208351373 hasConceptScore W3208351373C2776921476 @default.
- W3208351373 hasConceptScore W3208351373C2777289219 @default.
- W3208351373 hasConceptScore W3208351373C2779227376 @default.
- W3208351373 hasConceptScore W3208351373C49040817 @default.
- W3208351373 hasConceptScore W3208351373C71039073 @default.
- W3208351373 hasConceptScore W3208351373C79635011 @default.
- W3208351373 hasConceptScore W3208351373C97346530 @default.
- W3208351373 hasFunder F4320321001 @default.
- W3208351373 hasLocation W32083513731 @default.
- W3208351373 hasOpenAccess W3208351373 @default.
- W3208351373 hasPrimaryLocation W32083513731 @default.
- W3208351373 hasRelatedWork W2032895922 @default.
- W3208351373 hasRelatedWork W2102605029 @default.
- W3208351373 hasRelatedWork W2378360900 @default.
- W3208351373 hasRelatedWork W2555576484 @default.
- W3208351373 hasRelatedWork W2769802134 @default.
- W3208351373 hasRelatedWork W2906936695 @default.
- W3208351373 hasRelatedWork W3008224665 @default.
- W3208351373 hasRelatedWork W3100798500 @default.
- W3208351373 hasRelatedWork W4307781497 @default.
- W3208351373 hasRelatedWork W4366412532 @default.
- W3208351373 isParatext "false" @default.
- W3208351373 isRetracted "false" @default.
- W3208351373 magId "3208351373" @default.
- W3208351373 workType "article" @default.