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- W3208690623 abstract "Abstract In this article, we study the process of polymerization of a modified ED‐20 epoxy binder under conditions of highly filled systems. It is found that modifying additives affect the process of polymerization of the binder, increasing the degree of conversion of epoxy groups of ED‐20 resin, speeding up the process of polymerization, and increasing the exothermic effect of the reaction. Curing in the presence of a modifying silicon‐containing additive takes place in a mode that promotes the formation of a more ordered structure, creating opportunities for relaxation of internal stresses and favorable conditions for the formation of an ordered microstructure. The equations sufficiently fitting the measured points of the concentration of epoxy groups are calculated. We obtain the kinetic curves of curing, which illustrate the process of heat release of the ED‐20 binder and the same system modified with mineral fillers. It is found that the heat release occurs more intensively when modifiers are introduced into the epoxy binder. It is derived that the experimental data of kinetics of heat release at considered time range can be sufficiently described by a parabolic equation." @default.
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- W3208690623 date "2021-10-23" @default.
- W3208690623 modified "2023-10-16" @default.
- W3208690623 title "Kinetic features of polymerization of epoxy resin modified by silicon‐containing additives and mineral fillers" @default.
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- W3208690623 doi "https://doi.org/10.1002/pen.25833" @default.
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