Matches in SemOpenAlex for { <https://semopenalex.org/work/W3208753721> ?p ?o ?g. }
Showing items 1 to 91 of
91
with 100 items per page.
- W3208753721 abstract "With the advent of the 5G era, power devices and telecom equipment require small form factor and excellent thermal performance. Flip-chip Land Grid Array (FC-LGA) is rapidly becoming the package choice for those devices, because of its low RDS (ON) and high frequency operation. However, it also brings great challenges to reliability design. Large number of flip chip solder joints between die and substrate lead to a more rigid package body, which will accumulate strong thermomechanical stress under alternating temperature and so inevitably trigger package reliability issues. Excessive warpage and body crack will occur if without appropriate package design consideration. In this study, the thermo-mechanical behaviors of FC-LGA were investigated by finite element simulation under different TCC conditions. Due to the complexity of the LGA substrate, the simulation with detail substrate model in use will incur expensive computation. This work proposed a simplification method considering a substrate of complicated structure as an equivalent anisotropic volume. With simulation models simplified, DoE study was performed to investigate the influence of packaging materials and geometry on the thermo-mechanical reliability of FC-LGA packages in high efficiency. A higher die-to-EMC thickness ratio will result in a more severe package convex warpage, while using a thinner die and a thicker EMC layer can prevent package body from cracking during heating or cooling processes. Besides packaging geometry, the influence of substrate layouts and EMC mechanical properties were also studied to find the optimal packaging design to mitigate the risks of excessive package warpage and body crack." @default.
- W3208753721 created "2021-11-08" @default.
- W3208753721 creator A5001234818 @default.
- W3208753721 creator A5007246963 @default.
- W3208753721 creator A5015869047 @default.
- W3208753721 creator A5024363757 @default.
- W3208753721 creator A5063800558 @default.
- W3208753721 creator A5080827177 @default.
- W3208753721 creator A5087620494 @default.
- W3208753721 date "2021-09-14" @default.
- W3208753721 modified "2023-10-16" @default.
- W3208753721 title "The Impact of Packaging Materials on Thermomechanical Reliability of FC-LGA (Flip-Chip Land Grid Array) Package for 5G Application" @default.
- W3208753721 cites W1980492432 @default.
- W3208753721 cites W1986027887 @default.
- W3208753721 cites W2060286058 @default.
- W3208753721 cites W2796055146 @default.
- W3208753721 cites W2913426700 @default.
- W3208753721 doi "https://doi.org/10.1109/icept52650.2021.9568198" @default.
- W3208753721 hasPublicationYear "2021" @default.
- W3208753721 type Work @default.
- W3208753721 sameAs 3208753721 @default.
- W3208753721 citedByCount "0" @default.
- W3208753721 crossrefType "proceedings-article" @default.
- W3208753721 hasAuthorship W3208753721A5001234818 @default.
- W3208753721 hasAuthorship W3208753721A5007246963 @default.
- W3208753721 hasAuthorship W3208753721A5015869047 @default.
- W3208753721 hasAuthorship W3208753721A5024363757 @default.
- W3208753721 hasAuthorship W3208753721A5063800558 @default.
- W3208753721 hasAuthorship W3208753721A5080827177 @default.
- W3208753721 hasAuthorship W3208753721A5087620494 @default.
- W3208753721 hasConcept C111106434 @default.
- W3208753721 hasConcept C119599485 @default.
- W3208753721 hasConcept C121332964 @default.
- W3208753721 hasConcept C126233035 @default.
- W3208753721 hasConcept C127413603 @default.
- W3208753721 hasConcept C135628077 @default.
- W3208753721 hasConcept C159985019 @default.
- W3208753721 hasConcept C162877825 @default.
- W3208753721 hasConcept C163258240 @default.
- W3208753721 hasConcept C165005293 @default.
- W3208753721 hasConcept C186260285 @default.
- W3208753721 hasConcept C192562407 @default.
- W3208753721 hasConcept C2779227376 @default.
- W3208753721 hasConcept C43214815 @default.
- W3208753721 hasConcept C50296614 @default.
- W3208753721 hasConcept C62520636 @default.
- W3208753721 hasConcept C66938386 @default.
- W3208753721 hasConcept C68928338 @default.
- W3208753721 hasConcept C69567186 @default.
- W3208753721 hasConcept C78519656 @default.
- W3208753721 hasConcept C79072407 @default.
- W3208753721 hasConcept C94709252 @default.
- W3208753721 hasConceptScore W3208753721C111106434 @default.
- W3208753721 hasConceptScore W3208753721C119599485 @default.
- W3208753721 hasConceptScore W3208753721C121332964 @default.
- W3208753721 hasConceptScore W3208753721C126233035 @default.
- W3208753721 hasConceptScore W3208753721C127413603 @default.
- W3208753721 hasConceptScore W3208753721C135628077 @default.
- W3208753721 hasConceptScore W3208753721C159985019 @default.
- W3208753721 hasConceptScore W3208753721C162877825 @default.
- W3208753721 hasConceptScore W3208753721C163258240 @default.
- W3208753721 hasConceptScore W3208753721C165005293 @default.
- W3208753721 hasConceptScore W3208753721C186260285 @default.
- W3208753721 hasConceptScore W3208753721C192562407 @default.
- W3208753721 hasConceptScore W3208753721C2779227376 @default.
- W3208753721 hasConceptScore W3208753721C43214815 @default.
- W3208753721 hasConceptScore W3208753721C50296614 @default.
- W3208753721 hasConceptScore W3208753721C62520636 @default.
- W3208753721 hasConceptScore W3208753721C66938386 @default.
- W3208753721 hasConceptScore W3208753721C68928338 @default.
- W3208753721 hasConceptScore W3208753721C69567186 @default.
- W3208753721 hasConceptScore W3208753721C78519656 @default.
- W3208753721 hasConceptScore W3208753721C79072407 @default.
- W3208753721 hasConceptScore W3208753721C94709252 @default.
- W3208753721 hasLocation W32087537211 @default.
- W3208753721 hasOpenAccess W3208753721 @default.
- W3208753721 hasPrimaryLocation W32087537211 @default.
- W3208753721 hasRelatedWork W1947712349 @default.
- W3208753721 hasRelatedWork W2018914183 @default.
- W3208753721 hasRelatedWork W2065586335 @default.
- W3208753721 hasRelatedWork W2110051111 @default.
- W3208753721 hasRelatedWork W2121237192 @default.
- W3208753721 hasRelatedWork W2126979269 @default.
- W3208753721 hasRelatedWork W2148111082 @default.
- W3208753721 hasRelatedWork W2155179766 @default.
- W3208753721 hasRelatedWork W2175040102 @default.
- W3208753721 hasRelatedWork W2544446123 @default.
- W3208753721 isParatext "false" @default.
- W3208753721 isRetracted "false" @default.
- W3208753721 magId "3208753721" @default.
- W3208753721 workType "article" @default.