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• W3209605732 endingPage "103431" @default.
• W3209605732 startingPage "103431" @default.
• W3209605732 abstract "The leakage rate of solid-liquid phase change materials can be effectively reduced by shape-stabilized phase change material (SSPCM), but numerical simulations on SSPCM are less reported. This paper simulated the melting and solidification process of silicone rubber/[email protected]2 shape-stabilized phase change material (SR/[email protected]2). The effects of heating conditions and the content of phase change microcapsules on the heat transfer process of SR/[email protected]2 were studied. The simulation results showed that thermal conductivity was the main factor affecting heat transfer during the melting process, while during the solidification process, enthalpy was the main factor. During the melting and solidification process, the heat transfer of SR/[email protected]2 composites mainly relied on heat conduction. The complete melting time of SR/[email protected]2 under heating conditions at 328 K took at most 280 s, while under 1000 W/m2 required at least 1700s. The specific heat transfer characteristics were elucidated by temperature, liquid fraction, flow rate, and total surface heat flux date." @default.
• W3209605732 created "2021-11-08" @default.
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• W3209605732 date "2021-12-01" @default.
• W3209605732 modified "2023-10-17" @default.
• W3209605732 title "Experimental study and numerical simulation of heat transfer behavior based on silicone rubber/paraffin @SiO2 shape-stabilized phase change material" @default.
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• W3209605732 doi "https://doi.org/10.1016/j.est.2021.103431" @default.
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