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- W3211399095 abstract "This study investigates the effect of low-temperature temporary bonding on thickness uniformity, back grinding, and glue removal after debonding. 140 °C proves to be compatible with backside processes and effectively facilitates glue removal for microfluidic devices used in lifescience applications." @default.
- W3211399095 created "2021-11-22" @default.
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- W3211399095 date "2021-10-05" @default.
- W3211399095 modified "2023-10-16" @default.
- W3211399095 title "Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications" @default.
- W3211399095 doi "https://doi.org/10.1109/ltb-3d53950.2021.9598407" @default.
- W3211399095 hasPublicationYear "2021" @default.
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