FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3211414309> ?p ?o ?g. }

• W3211414309 endingPage "114412" @default.
• W3211414309 startingPage "114412" @default.
• W3211414309 abstract "Thermal-compression bonding (TCB) is the key technology to ensure vertical chip (or wafer) stacking in three-dimensional (3D) integration with higher I/O density than conventional soldering technology. For different TCB approaches, copper (Cu) to Cu bonding has always been the preferred candidate due to the excellent electrical and thermal properties of Cu, high mechanical strength of bonding interface, as well as compatibility and cost consideration in the packaging fabrication. However, high thermal budget of the bonding process caused by oxidation of Cu leads to issue of wafer warpage, bonding misalignment, and compatibility with back-end-of-line process. Therefore, this review paper first presents an extensive survey on the advance of low temperature Cu-based bonding technologies. In addition, the feasibility of CuCu bonding in the fine pitch applications is challenged by coplanarity issue of Cu pillars and insufficient gaps for filling. Accordingly, based on the progress of low temperature CuCu bonding, low temperature Cu/SiO2 hybrid bonding will be introduced as an emerging bonding technology to solve the coplanarity and filling issue, which can provide the great potential for 3D integration with ultra-high density of interconnection." @default.
• W3211414309 created "2021-11-22" @default.
• W3211414309 creator A5001678219 @default.
• W3211414309 creator A5030670785 @default.
• W3211414309 date "2021-12-01" @default.
• W3211414309 modified "2023-09-26" @default.
• W3211414309 title "Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)" @default.
• W3211414309 cites W1591076839 @default.
• W3211414309 cites W1969530042 @default.
• W3211414309 cites W1972820050 @default.
• W3211414309 cites W1979542923 @default.
• W3211414309 cites W1979613600 @default.
• W3211414309 cites W2026895301 @default.
• W3211414309 cites W2039182669 @default.
• W3211414309 cites W2042982549 @default.
• W3211414309 cites W2049017279 @default.
• W3211414309 cites W2064390073 @default.
• W3211414309 cites W2067189821 @default.
• W3211414309 cites W2070676114 @default.
• W3211414309 cites W2070720201 @default.
• W3211414309 cites W2082247553 @default.
• W3211414309 cites W2083260984 @default.
• W3211414309 cites W2086750013 @default.
• W3211414309 cites W2087521992 @default.
• W3211414309 cites W2093073592 @default.
• W3211414309 cites W2094177705 @default.
• W3211414309 cites W2117988687 @default.
• W3211414309 cites W2152721748 @default.
• W3211414309 cites W2174385795 @default.
• W3211414309 cites W2738213254 @default.
• W3211414309 cites W2982809341 @default.
• W3211414309 cites W3034999852 @default.
• W3211414309 cites W3038040006 @default.
• W3211414309 cites W3095571208 @default.
• W3211414309 cites W3100858038 @default.
• W3211414309 doi "https://doi.org/10.1016/j.microrel.2021.114412" @default.
• W3211414309 hasPublicationYear "2021" @default.
• W3211414309 type Work @default.
• W3211414309 sameAs 3211414309 @default.
• W3211414309 citedByCount "20" @default.
• W3211414309 countsByYear W32114143092022 @default.
• W3211414309 countsByYear W32114143092023 @default.
• W3211414309 crossrefType "journal-article" @default.
• W3211414309 hasAuthorship W3211414309A5001678219 @default.
• W3211414309 hasAuthorship W3211414309A5030670785 @default.
• W3211414309 hasConcept C119599485 @default.
• W3211414309 hasConcept C120793396 @default.
• W3211414309 hasConcept C121332964 @default.
• W3211414309 hasConcept C123745756 @default.
• W3211414309 hasConcept C127413603 @default.
• W3211414309 hasConcept C136525101 @default.
• W3211414309 hasConcept C140269135 @default.
• W3211414309 hasConcept C142724271 @default.
• W3211414309 hasConcept C153294291 @default.
• W3211414309 hasConcept C159985019 @default.
• W3211414309 hasConcept C160671074 @default.
• W3211414309 hasConcept C165005293 @default.
• W3211414309 hasConcept C186937647 @default.
• W3211414309 hasConcept C191897082 @default.
• W3211414309 hasConcept C192562407 @default.
• W3211414309 hasConcept C201414436 @default.
• W3211414309 hasConcept C201845621 @default.
• W3211414309 hasConcept C204530211 @default.
• W3211414309 hasConcept C204787440 @default.
• W3211414309 hasConcept C20625954 @default.
• W3211414309 hasConcept C2524010 @default.
• W3211414309 hasConcept C2778071519 @default.
• W3211414309 hasConcept C2778648169 @default.
• W3211414309 hasConcept C2779133538 @default.
• W3211414309 hasConcept C2779227376 @default.
• W3211414309 hasConcept C2984173401 @default.
• W3211414309 hasConcept C31258907 @default.
• W3211414309 hasConcept C33347731 @default.
• W3211414309 hasConcept C33923547 @default.
• W3211414309 hasConcept C41008148 @default.
• W3211414309 hasConcept C46141821 @default.
• W3211414309 hasConcept C49040817 @default.
• W3211414309 hasConcept C50296614 @default.
• W3211414309 hasConcept C530198007 @default.
• W3211414309 hasConcept C544778455 @default.
• W3211414309 hasConcept C59088047 @default.
• W3211414309 hasConcept C71924100 @default.
• W3211414309 hasConcept C78519656 @default.
• W3211414309 hasConceptScore W3211414309C119599485 @default.
• W3211414309 hasConceptScore W3211414309C120793396 @default.
• W3211414309 hasConceptScore W3211414309C121332964 @default.
• W3211414309 hasConceptScore W3211414309C123745756 @default.
• W3211414309 hasConceptScore W3211414309C127413603 @default.
• W3211414309 hasConceptScore W3211414309C136525101 @default.
• W3211414309 hasConceptScore W3211414309C140269135 @default.
• W3211414309 hasConceptScore W3211414309C142724271 @default.
• W3211414309 hasConceptScore W3211414309C153294291 @default.
• W3211414309 hasConceptScore W3211414309C159985019 @default.
• W3211414309 hasConceptScore W3211414309C160671074 @default.
• W3211414309 hasConceptScore W3211414309C165005293 @default.
• W3211414309 hasConceptScore W3211414309C186937647 @default.
• W3211414309 hasConceptScore W3211414309C191897082 @default.
• W3211414309 hasConceptScore W3211414309C192562407 @default.

• next