Matches in SemOpenAlex for { <https://semopenalex.org/work/W3213383279> ?p ?o ?g. }
- W3213383279 endingPage "491" @default.
- W3213383279 startingPage "443" @default.
- W3213383279 abstract "A through-substrate via (TSV) is an electrical interconnect, which passes vertically through a substrate to conduct the electrical signals from one side of the substrate to the other. As an enabling technology, TSVs allow micro electro mechanical system (MEMS) devices and systems to achieve new integration schemes and wafer-level vacuum packaging with high performance, multifunctions, low costs, high reliability, and small package sizes. Typically a TSV consists of a through-hole etched in a substrate, a conductor in the through-hole, and an insulator isolating the conductor from the substrate. Although TSVs facilitate MEMS and complementary metal oxide semiconductor integration, process compatibility is a concern in MEMS applications. The methods for TSV fabrication highly depends on the TSV configurations and the materials. Polysilicon TSVs have minimized thermal stresses, good process compatibility, and low fabrication costs. Metal TSVs have more significant diversities than other TSVs in metal materials, TSV configurations, and fabrication methods." @default.
- W3213383279 created "2021-11-22" @default.
- W3213383279 creator A5060708168 @default.
- W3213383279 date "2021-04-23" @default.
- W3213383279 modified "2023-09-23" @default.
- W3213383279 title "Through‐substrate Vias" @default.
- W3213383279 cites W1505620869 @default.
- W3213383279 cites W1965469072 @default.
- W3213383279 cites W1969448236 @default.
- W3213383279 cites W1969576532 @default.
- W3213383279 cites W1970831471 @default.
- W3213383279 cites W1976268392 @default.
- W3213383279 cites W1978391578 @default.
- W3213383279 cites W1981752752 @default.
- W3213383279 cites W1986725458 @default.
- W3213383279 cites W1991311969 @default.
- W3213383279 cites W1992261114 @default.
- W3213383279 cites W1993107499 @default.
- W3213383279 cites W1994480027 @default.
- W3213383279 cites W1996654684 @default.
- W3213383279 cites W1997913942 @default.
- W3213383279 cites W2003766830 @default.
- W3213383279 cites W2004204877 @default.
- W3213383279 cites W2005106505 @default.
- W3213383279 cites W2005538990 @default.
- W3213383279 cites W2006032271 @default.
- W3213383279 cites W2016999624 @default.
- W3213383279 cites W2022454657 @default.
- W3213383279 cites W2023515259 @default.
- W3213383279 cites W2025188940 @default.
- W3213383279 cites W2026635780 @default.
- W3213383279 cites W2028692081 @default.
- W3213383279 cites W2033880482 @default.
- W3213383279 cites W2035399608 @default.
- W3213383279 cites W2037214200 @default.
- W3213383279 cites W2037632003 @default.
- W3213383279 cites W2038571544 @default.
- W3213383279 cites W2040987087 @default.
- W3213383279 cites W2043529430 @default.
- W3213383279 cites W2046139226 @default.
- W3213383279 cites W2050481534 @default.
- W3213383279 cites W2054218457 @default.
- W3213383279 cites W2056521237 @default.
- W3213383279 cites W2058242026 @default.
- W3213383279 cites W2068362851 @default.
- W3213383279 cites W2069049193 @default.
- W3213383279 cites W2071300841 @default.
- W3213383279 cites W2078318663 @default.
- W3213383279 cites W2079716905 @default.
- W3213383279 cites W2082164399 @default.
- W3213383279 cites W2084228930 @default.
- W3213383279 cites W2085659752 @default.
- W3213383279 cites W2089423461 @default.
- W3213383279 cites W2099839833 @default.
- W3213383279 cites W2109622694 @default.
- W3213383279 cites W2111732008 @default.
- W3213383279 cites W2113425773 @default.
- W3213383279 cites W2115065996 @default.
- W3213383279 cites W2115446257 @default.
- W3213383279 cites W2132596793 @default.
- W3213383279 cites W2133308853 @default.
- W3213383279 cites W2142091828 @default.
- W3213383279 cites W2146531121 @default.
- W3213383279 cites W2149832899 @default.
- W3213383279 cites W2151613126 @default.
- W3213383279 cites W2152051455 @default.
- W3213383279 cites W2154309229 @default.
- W3213383279 cites W2154420106 @default.
- W3213383279 cites W2155044490 @default.
- W3213383279 cites W2156084757 @default.
- W3213383279 cites W2158170372 @default.
- W3213383279 cites W2169714075 @default.
- W3213383279 cites W2181990293 @default.
- W3213383279 cites W2254426558 @default.
- W3213383279 cites W2288014285 @default.
- W3213383279 cites W2326102823 @default.
- W3213383279 cites W2462173051 @default.
- W3213383279 cites W2462279116 @default.
- W3213383279 cites W2497216985 @default.
- W3213383279 cites W2556528087 @default.
- W3213383279 cites W2563567322 @default.
- W3213383279 cites W2564397219 @default.
- W3213383279 cites W2566780915 @default.
- W3213383279 cites W2573926654 @default.
- W3213383279 cites W2605732173 @default.
- W3213383279 cites W2616349962 @default.
- W3213383279 cites W2616372290 @default.
- W3213383279 cites W2724103016 @default.
- W3213383279 cites W2772009786 @default.
- W3213383279 cites W2786553683 @default.
- W3213383279 cites W2791581107 @default.
- W3213383279 cites W2887219558 @default.
- W3213383279 cites W2888339933 @default.
- W3213383279 cites W2891367246 @default.
- W3213383279 cites W2898169836 @default.
- W3213383279 cites W2910176406 @default.
- W3213383279 cites W2921078285 @default.
- W3213383279 cites W4239250096 @default.