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- W322526459 abstract "Abstract : Ni2Si Ohmic contacts were fabricated via pulsed laser deposition on n-SiC. The contacts' electrical, structural, compositional, and surface morphological properties were investigated as a function of annealing temperatures ranging from 700 to 950 deg C. The as-deposited and 700 deg C annealed contacts were non-Ohmic. Annealing at 950 deg C yielded excellent Ohmic behavior, an abrupt void-free interface, and a smooth surface morphology. No residual carbon was present within the contact metallization or at the contact-SiC interface, and the contact showed no appreciable thickness increase as a result of the annealing process. The results demonstrate that aside from maintaining the desirable electrical integrity associated with Ni and Ni/Si Ohmic contacts, the Ni2Si Ohmic contacts possessed improved interfacial, compositional, microstructural, and surface properties which are required for reliable high temperature and high power device operation." @default.
- W322526459 created "2016-06-24" @default.
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- W322526459 date "2001-06-01" @default.
- W322526459 modified "2023-09-23" @default.
- W322526459 title "Direct Deposition of Low Resistance Thermally Stable Ohmic Contacts to n-SiC" @default.
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- W322526459 doi "https://doi.org/10.21236/ada399248" @default.
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