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- W327729968 abstract "Major areas of the metallization process were examined in order to determine whether or not a major ink chemistry change could be avoided by making relatively minor changes in the processing in order to give consistent excellent initial adhesion and long-term adhesion. All results suggested that the adhesion strength is very sensitive to the ink and its processing. It was also learned that the difference in surface roughness between alkali and acid etched solar cells does not have a significant effect on resulting film adhesion. In order to overcome the effects on adhesion of minor variations in the metallization process, a permanent binding agent in the form of a MOD compound was sought. Bismuth 2-ethylhexanoate proved to be suitable MOD compound which would impart consistent initial as well as long-term adhesion by decomposing to bismuth oxide in the fired films. The presence of bismuth oxide has significant detrimental effects on film sheet resistance such that multi-layer films will be more necessary than before. Finally, the processing of multi-layer films has presented some problems with film stability as multi-layer fired films have shown considerable cracking which destroys adhesion." @default.
- W327729968 created "2016-06-24" @default.
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- W327729968 date "1984-12-21" @default.
- W327729968 modified "2023-09-26" @default.
- W327729968 title "MOD silver metallization for photovoltaics. Quarterly technical report, September 1-November 30, 1984" @default.
- W327729968 doi "https://doi.org/10.2172/6086372" @default.
- W327729968 hasPublicationYear "1984" @default.
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