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- W334713666 abstract "Wireless products such as cellular phones and two-way radios are typically composed of three main functional blocks - digital control, radio frequency (RF), and user interface. The focus here is on the digital control and RF blocks. With the ongoing reduction in product size and increased product functionality, the performance requirements for the main board for each of these two blocks is starting to diverge. The migration toward to .75mm micro-ball grid array (BGA) packages and .5mm chip scale packages (CSP) for high I/O microprocessor, digital signal processor, and memory integrated circuits has concentrated the need for the main board to have much greater routing capacity in the digital control section than in the RF section. In a product with a single main board, the digital control section dictates the routing capacity of the board. Single layer microvia high density interconnect printed circuit board technology is the most efficient technology that meets the current requirements for both blocks. However, as the routing capacity requirements for two blocks becomes more divergent multichip and multifunctional modules can be an effective alternative to the single chip approach. Design scenarios for various two-way radio products highlight the impact single chip and multichip approaches have on the printed circuit board technology used for the main board." @default.
- W334713666 created "2016-06-24" @default.
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- W334713666 date "1999-01-01" @default.
- W334713666 modified "2023-09-23" @default.
- W334713666 title "Substrate Requirements for Effective Integration of Chip Scale Packages and Multichip Modules in Portable Wireless Products" @default.
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