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- W346443698 abstract "A novel via-first, back-end-of-the-line (BEOL) compatible, monolithic wafer-level three-dimensional (3D) interconnect technology platform is presented. This platform employs wafer bonding of damasc ..." @default.
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- W346443698 date "2006-01-01" @default.
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- W346443698 title "Unit processes for Cu/BCB redistribution layer bonding for 3D ICs" @default.
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