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• W4200288670 abstract "The critical aspect of circuit realization at higher frequencies poses various challenges as a small drift in phase or line parameters drastically affects circuit performances and the grounding effect becomes prominent at higher frequencies. Hence, attachment and proper field launching aspects becomes important. This article presents four innovative processes which have been developed for overcoming these challenges for timely realisation of a reliable millimeter wave Data Transmitter: attachment of thin Printed Circuit Boards (PCBs) to carrier plates using epoxy film to avoid bowing issues and enhance proper electrical grounding, pattern generation with 40 μm feature size in 45 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>o</sup> phase shifter, trimming of microstrip length to achieve required phase-shift angle and assembly of state-of-the-art Radio-Frequency (RF) connector pins. Data Transmitter at high frequency thus realised was flown onboard and performance is satisfactory. In this article, the various new processes developed to enable reliable performance of the circuits at higher frequencies are presented. Also, it addresses the challenges as well as the mitigation techniques. The results are also presented." @default.
• W4200288670 created "2021-12-31" @default.
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• W4200288670 date "2021-10-24" @default.
• W4200288670 modified "2023-10-14" @default.
• W4200288670 title "Process Challenges and Mitigation Techniques for Realization of RF Modules at Millimeter-wave Frequencies" @default.
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• W4200288670 doi "https://doi.org/10.1109/mysurucon52639.2021.9641596" @default.
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