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• W4200569898 abstract "This work proposes a cost-effective technique to evaluate the reliability of adhesive bonding quality assessment with ultrasonic NDT. Detectability of debonding defects and weak bonds in aluminum-epoxy single lap joints was estimated by the model-assisted probability of detection curves. For those adhesive joints containing three different bonding qualities –debonding at the interface, weak bond with release agent contamination, and weak bond due to faulty curing– numerical models were built. Ultrasonic wave propagation was simulated by using the semi-analytical finite element method via CIVA and validated with experimental investigations. In order to create a parametric study, uncertain parameters and their distribution were determined based on experiments and expertise. Ultrasonic signal responses in the time and frequency domain were analyzed as opposed to defect characteristic values. According to reliability analysis, it is shown that the detection probability of debonding is mostly based on the gate selection and ultrasonic echo amplitude, while weak bond detection requires a more delicate assessment. Frequency-based calculations can improve the detection reliability of weak bonds due to release agent contamination. Weak bonds caused by faulty curing can be detected via frequency domain maximum amplitude or the attenuation of the signal response. • Model assisted probability of detection for ultrasonic NDT of adhesive joints. • Quantitative debonding and weak bond detection evaluation with MAPOD. • Debonding PoD is increased with smart gate selection. • The best parameter to detect weak bond due to poor curing is attenuation. • The best parameter to detect weak bond due to contamination is frequency shift." @default.
• W4200569898 created "2021-12-31" @default.
• W4200569898 creator A5017308611 @default.
• W4200569898 creator A5084756446 @default.
• W4200569898 creator A5091567397 @default.
• W4200569898 date "2022-03-01" @default.
• W4200569898 modified "2023-09-29" @default.
• W4200569898 title "Model-assisted reliability assessment for adhesive bonding quality evaluation with ultrasonic NDT" @default.
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• W4200569898 doi "https://doi.org/10.1016/j.ndteint.2021.102596" @default.
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