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- W4205125073 endingPage "152523" @default.
- W4205125073 startingPage "152523" @default.
- W4205125073 abstract "The acceleration effect of Cl- and bis-(sodium sulfopropyl)-disulfide (SPS) in electroplating solution was analyzed by various electrochemical methods and dynamic simulation with DFT. The cathodic polarization, solution resistance, and nuclear transfer coefficient of the two electroplating systems were analyzed by electrochemical methods; OLYMPUS confocal laser microscope was used to explore the throwing power (TP) and average thickness of the coating (ATCH) in PCB. The multi-step energy change of two systems are used to analyze the reduction process of Cu2+/1+ based on the first principles. The TP and ACTH of SCS (SPS-Cu2+/1+) and SCCS (SPS-Cu2+/1+-Cl-) are 85%, 95%, 56.57 μm and 65.77 μm, respectively. Scanning electron microscope analysis shows that the nucleation rate of the SCCS system is higher than that of the SCS system in 0.2 s. In the dynamic analysis of the system, the reduction of Cu2+/1+ in the SCCS system only needs three steps, while that in the SCS system needs five steps. The experimental and theoretical results show that the reduction rate of Cu2+/1+ in the bath containing Cl- is faster than that in the bath without Cl-." @default.
- W4205125073 created "2022-01-25" @default.
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- W4205125073 date "2022-05-01" @default.
- W4205125073 modified "2023-10-04" @default.
- W4205125073 title "Revealing the acceleration effect of SPS and Cl - on copper Surface: Instantaneous nucleation and Multi-Step energy change" @default.
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- W4205125073 doi "https://doi.org/10.1016/j.apsusc.2022.152523" @default.
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