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- W4210404803 abstract "The mechanical properties of thin films are under-researched because of the challenges associated with conventional experimental methods. We demonstrate a technique for determining the intrinsic shear strength and strain of thin films using a nano-cutting technique based on an orthogonal cutting model with precise control of the cutting system. In this study, electroplated Cu films with thicknesses of 1.5 μm and 5 μm and a sputtered Cu film with a thickness of 130 nm were fabricated to evaluate the mechanical strength. Experiments revealed a shear strength of approximately 310 MPa with a shear strain of 1.57 for the electroplated Cu film and a shear strength of 389 MPa with a shear strain of 2.03 for the sputtered Cu film. In addition, X-ray diffraction analysis was performed to correlate the experimental results." @default.
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- W4210404803 date "2022-01-26" @default.
- W4210404803 modified "2023-09-30" @default.
- W4210404803 title "Measurement of Shear Strengths of Cu Films Using Precise Chip Forming" @default.
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- W4210404803 doi "https://doi.org/10.3390/ma15030948" @default.
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