Matches in SemOpenAlex for { <https://semopenalex.org/work/W4211034791> ?p ?o ?g. }
Showing items 1 to 62 of
62
with 100 items per page.
- W4211034791 endingPage "265" @default.
- W4211034791 startingPage "245" @default.
- W4211034791 abstract "Free Access References Bjoern Bartels, Bjoern BartelsSearch for more papers by this authorUlrich Ermel, Ulrich ErmelSearch for more papers by this authorMichael Pecht, Michael PechtSearch for more papers by this authorPeter Sandborn, Peter SandbornSearch for more papers by this author Book Author(s):Bjoern Bartels, Bjoern BartelsSearch for more papers by this authorUlrich Ermel, Ulrich ErmelSearch for more papers by this authorMichael Pecht, Michael PechtSearch for more papers by this authorPeter Sandborn, Peter SandbornSearch for more papers by this author First published: 09 April 2012 https://doi.org/10.1002/9781118275474.refs Series Editor(s): Andrew P. Sage, Andrew P. SageSearch for more papers by this author AboutPDFPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShareShare a linkShare onFacebookTwitterLinked InRedditWechat References ABI Forecasts Wireless to Grow by Billions, Advanced Packaging, vol. 9, no. 3. March 1, 2000. Adamson, S. J., CSP and Flip Chip Packaging, AdvancedPackaging, vol. 9, January 1, 2000. Adbusters, Consumer Society Is Made to Break, https://www.adbusters.org/category/tags/obsolescence, accessed on April 5, 2010. Air Force Research Laboratory, Wright Patterson Air Force Base, Ohio, Research and Development (R&D) Supportability Design Guide, AFRL, 1998. Ahuja, G., and Katila, R., Technological Acquisitions and the Innovation Performance of the Acquiring Firms: A Longitudinal Study, Strategic Management Journal, vol. 22, pp. 197– 220, 2001. Allocation Components BlogSpot, Electronic Components: Allocation, Lead Times & Shortages, http://allocationcomponents.blogspot.com/, accessed on April 11, 2010. Allocation Components BlogSpot, Tragic Japan Earthquake Affects Some Electronic Semiconductor Manufacturing Facilities, http://allocationcomponents.blogspot .com/2011/03/tragic-japan-earthquake-affects-some.html, accessed on July 6, 2011. Apple Inc., Macbook Air Product Website, http://www.apple.com/de/macbookair/specs.html, accessed on October 23, 2010. APT News, The Bill Gates Method, July 21, 2003, http://www.placementpartner.com/apt%20news/news7-21-03.html. Angel Investor News, Thought Provoking Advice, http://www.angel-investor-news .com/Articles-Advice-To-Ponder.htm, accessed on April 6, 2010. ARINC Report, Design Guide for Integrated Avionics, ARINC Report 651, Aeronautical Radio Inc., Annapolis, MD, November 1, 1991. ARINC Report, Avionics Application Software Standard Interface, ARINC Specification 653, Aeronautical Radio Inc., Annapolis, MD, January 1, 1997. ARINC Report, Strategies to Address Electronic Component Obsolescence in Commercial Aircraft, ARINC Report 662, Aeronautical Radio Inc., Annapolis, MD, December 1, 1999a. ARINC Report, Aeronautical Radio Inc. Annapolis MD, Resolution Cost Factors for DiminishingManufacturing Sources andMaterial Shortages, February 1, 1999b, http://www.dmea.osd.mil/dmsms_resolution_cost_factors-all.pdf, accessed on January 15, 2002. ARM Ltd, Product Website on Embedded Memory SRAM IP, http://www.arm.com/products/physical-ip/embedded-memory-ip/sram.php, accessed on November 2, 2010. Arnold, H., Elektroniknet.de, Programmierbarkeit und Innovationsfreude, http://www.elektroniknet.de/bauelemente/news/article/31159/0/Programmierbarkeit_und_Innovationsfreude/, accessed on December 22, 2010. Atmel Cooperation, Product Website of AT25DF161, http://www.atmel.com:80/dyn/products/product_card.asp?part_id=1890, accessed on November 16, 2010a. Atmel Cooperation, Product Obsolescence Information Website, http://www.atmel. com/dyn/quality/quality_prod_obsl_result.asp, accessed on November 22, 2010b. Atmel Cooperation, Product Website and Datasheet of AT45DB161D, http://www.atmel. com/dyn/resources/prod_documents/doc3500.pdf, accessed on November 22, 2010c. Atterbury, R., Component Obsolescence Group, United Kingdom; Minenfeld Obsolescence, A Guide to Tackling Disappearing Products, Issue 2, 2005. Avnet Abacus Lead Time Prognosis Overview, Monday, March 15, 2010, http://www .avnet-abacus.eu/services/lead-time-overview/, accessed on April, 11, 2010. Baca, M., QinetiQ Technology Extension Corporation, April 2010. Baer, D., Wermke, M., Duden-das grosse Fremdwoerterbuch. Herkunft und Bedeutung der Fremdwoerter. mit “umgekehrtem” Woerterbuch: deutsches Wort-Fremdwort. 2., neu bearb. und erw. Aufl. Mannheim: Dudenverlag, 2000. Bartsch, H.-J., TaschenbuchMathematischerFormeln, S. 599, 16.Auflage, Fachbuchverlag Leipzig, 1994. Battersbury, C., Component Obsolescence Group, United Kingdom, The Date Coding Minefield. A Guide to Component Traceability through the Date Code, 2003. Battersbury, C., Component Obsolescence Group, United Kingdom, The Counterfeit Electronic Components Minefield, A Guide to Understanding and Avoiding Counterfeit Components, Issue 1, 2008. Bayus, B., An Analysis of Product Lifetimes in a Technologically Dynamic Industry. Management Science, vol. 44, pp. 763– 775, 1998. Berka, S., Operating Systems Website, http://www.operating-system.org/betriebssystem/_german/bs-winnt31.htm, accessed on October 12, 2010. Biagini, R., Rowland, M., Jackson, M., and Pecht, M., Tipping the Scales in Your Favor When Uprating, Circuits & Devices, pp. 15– 23, July 1999. Boston Consulting Group, The Product Portfolio, January 1970, http://www.bsg.com/expertise_impact/publications//PublicationsDetails.aspx?id=tcm:12–13257, accessed on April 3, 2010. Brewin, A., Component Obsolescence Group, United Kingdom, The Pb-free Minefield, A Guide to Mitigating Risk during the Transition to RoHS Compliance, 2005. Brinton, J. B., SRAM: Integration Taking Starch out of Unit Growth, Semiconductor Business News, 06. January 2000, CMP Media, http://www.siliconstrategies.com/story/OEG20000106S0010, accessed on January 15, 2002. Bronstein, I.N., Semendjajew, K.A., Taschenbuch der Mathematik, 24. Auflage, page 664. Brown, G., Lu, J., and Wolfson, R. 1964. Dynamic Modeling of Inventories Subject to Obsolescence. Management Science, vol. 11, no. 1, pp. 51– 63, 1964. Brown, P., IBM Says No to Rambus, Electronic News, May 31, 1999, Cahners Business Information, http://www.e-insite.net/electronicnews/index.asp?layout=article&articleid=CA71026&pubdate=5/31/1999, accessed on January 15, 2002. Brown, W. D., and Brewer, J. E., Nonvolatile Semiconductor Memory Technology: A Comprehensive Guide to Understanding and Using NVSM Devices, New York: IEEE Press, 1998. BSI British Standards Society,About BSIBritish Standards, http://www.bsigroup.com/en/Standards-and-Publications/About-BSI-British-Standards/, accessed on November 19, 2010a. BSI British Standards Society, Obsolescence Management—Guide to the Substitution of Components in Electronic Equipment, PD 6614, June 16, 2002b. Bumbalough, A., USAF Manufacturing Technology’s Initiative on Electronics Parts Obsolescence Management, Proceedings of 44th International SAMPE Symposium, pp. 2044– 2051, May 1999. Cahners Business Information, Process Pedal to the Metal, Electronic News, February 8, 1999, http://www.e-insite.net/electronicnews/index.asp?layout=article&articleId= CA71985, accessed on January 14, 2002. Cahners Business Information, EDN’s 27th Annual Microprocessor and Microcontroller Directory, Electronic Design News, 14. September 2000a, Cahners Business Information, http://www.e-insite.net/ednmag/index.asp?layout=article&articleId= CA47177&stt=001, accessed on January 15, 2002. Cahners Business Information, DSP Market Growth Is Strong; $4 Billion Barrier Broken, Electronic News, 2000b. CALCE, Center for Advanced Life Cycle Engineering, About CALCE, http://www .calce.umd.edu/general/general.htm, accessed on November 19, 2010. Carbone, J., Growth Means More Consolidation, More Services, Purchasing Magazine, October 19, 2000, PennWell Corporation. http://www.manufacturing.net/pur/index .asp?layout=articleWebzine&articleid=CA139164, accessed on January 21, 2001. Carbone, J., Buyers Are Putting the Pieces Together, Purchasing Magazine, 22. March 2001. PennWell Corporation, http://www.manufacturing.net/pur/index.asp?layout= articleWebzine&articleid=CA139772, accessed on January 14, 2002. Carbone, J. Where Are the Parts? Purchasing, vol. 132, pp. 44– 47, 2003. Cattani, K. D., and Souza, G. C., Good Buy? Delaying End-of-Life Purchases, European J. of Operational Research, vol. 146, pp. 216– 228, 2003. Cavill, P. J., Whole Program Life COTS: Warding Off the Curse of Component Obsolescence, Military & Aerospace Electronics, 01. December 2000. PennWell Corporation, http://mae.pennwellnet.com/Articles/Article_Display.cfm?Section=Archives& Subsection=Display&ARTICLE_ID=88120, accessed on January 15, 2002. Chakravarti, A. K, Vasanta, B., Krishnan, A.S.A., and Dubash, R. K., Modified Delphi Methodology for Technology Forecasting: Case Study of Electronics and Information Technology, Technological Forecasting & Social Change, vol. 58, no. 1–2, pp. 155– 166, 1998. Christiansen, D., Electronics Engineer’s Handbook, New York: McGraw Hill, 1997. CIE, Does Software Go Obsolete?, Components in Electronics, March 2006. CMP Media, Top Semiconductor Suppliers 2000 MCUs, Electronic Business, March 1, 1999, http://img.cmpnet.com/ebn/graphics/0601/topsemimcu.pdf, accessed on January 25, 2002. CMP Media, Toshiba Aims Stacked 8-Mbit SRAM/64-Mbit Flash at Cell Phones, Semiconductor Business News, March 9, 2000a, http://www.siliconstrategies.com/story/OEG20000309S0004, accessed on January 15, 2002. CMP Media, TSMC MoSys Fabricate Ultra-dense Embedded SRAM on 0.15-micron Process, Semiconductor Business News, May 17, 2000b, http://www.siliconstrategies. com/story/OEG20000517S0035, accessed on January 15, 2002. CMP Media, UMC Claims Foundry Technology Lead with Copper SRAM Made with 0.13-Micron Process, Semiconductor Business News, May 12, 2000c, http://www .siliconstrategies.com/story/OEG20000512S0017, accessed on January 15, 2002. CMP Media, DSP Design Trends: TI Retains Leadership Position in DSP Market, Communication System Design (Special Section), April 1, 2000d, http://www .csdmag.com/main/2000/04/0004trend2.htm, accessed on January 15, 2002. CMP Media, Copper Tool Spending Will Grow 50% in 2000 Says Report, Semiconductor Business News, February 2, 2000e. CMP Media, With Wafer Reclamation Growing, Company Renames Itself TTI Silicon, Semiconductor Business News, January 19, 2000f, www.siliconstrategies.com/story/OEG20000119S0036, accessed on January 15, 2002. CMP Media, Microprocessors, Electronic Business Online, June 6, 2001a, http://www .ebnonline.com/story/OEG20010604S0102, accessed on January 18, 2002. CMP Media, Top Semiconductor Suppliers—Analog ICs, Electronic Buyers News, June 6, 2001b, CMP Media, http://www.ebnonline.com/story/OEG20010605S0059, accessed on January 18, 2002. CMP Media, TSMC to Offer MoSys Embedded SRAM Technology in 0.18-micron Process, Semiconductor Business News, January 31, 2000, http://www.siliconstrategies. com/story/OEG20000131S0023, accessed on January 15, 2002. CNET, ASE Acquires Two Motorola Chip Plants, July 6, 1999, http://news.cnet.com/news/0–1006–200–344451.html, accessed on January 15, 2002. COG, Component Obsolescence Group, Introductory Presentation, http://www.cog .org.uk/PDF/cog%20presentation%20(2).pdf, accessed on November 19, 2010. ComputerInfoWeb.com, Computer Electronics, Blu-Ray, http://www.computerinfoweb .com/computer_electronics/Blu_Ray.php, accessed on April 5, 2010. Condra, L., Combating Electronic Obsolescence by Using Common Processes, 2nd Annual NDIA Systems Engineering & Supportability Conference, Sept. 1999. Condra, L., Anissipour, A., Mayfield, D., and Pecht, M., Electronic Components Obsolescence, IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, vol. 20, pp. 368– 371, 1997. Condra, L., and Das, D., Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers-Specified Temperature Ranges, IEEE Transactions on Components and Packaging Technologies, vol. 24, pp. 721– 728, Dec. 1, 2001. Condra, L., Followell, D., Houchens, G., Jenks, J., Koehler, M., and Porter, Z., Minimizing the Effects of Electronic Component Obsolescence, Aero Magazine, 10, April 1, 2000, Boeing Company. Seattle, WA, http://www.boeing.com/commercial/aeromagazine/aero_10/elect.pdf, accessed on January 14, 2002. Condra, L., Hoad, R., Humphrey, D., Brennom, T., Fink, J., Heebink, J., Wilkinson, C., Marlborough, D., Das, D., Pendse, N., and Pecht, M., Terminology for Use of Electronic Parts outside the Manufacturers Specified Temperature, IEEE Transactions on Components and Packaging Technology, vol. 22, pp. 355– 356, Sept. 1, 1999. Condra, L., and Matthews, J., The Growing Problem of Component Obsolescence, Avionics Magazine, March 1999. Crane DMS Technology Center, U.S. Navy, GEM: The Generalized Emulation of Microcircuits, Navsea, http://dtc-dms.crane.navy.mil/html/gem.htm, accessed on January 15, 2002. Cushing, M. J., Mortin, D. E., Stadterman, T. J., and Malhotra, A., Comparison of Electronics-reliability Assessment Approaches, IEEE Transactions on Reliability, vol. 42, Dec. 1, 1993. Cypress Semiconductor, Inc., Design Guide QDRII, QDRII+,DDRII and DDRII+ Design Guide, AN4065, Document No. 001–15486 Rev.*A, http://www.qdrconsortium .com/technotes/cypress/an4065_12.pdf, accessed on November 1, 2010. Das, D., Pendse, N., and Wilkinson, C., Parameter Recharacterization: A Method of Thermal Uprating, IEEE Transactions on Components and Packaging Technologies, vol. 24, pp. 729– 737, Dec. 1, 2001. Dasgupta, A., Magrab, E. B., Anand, D. K., Eisinger, K., McLeish, J. G., Torres, M. A., Lall, P., and Dishongh, T. J., Perspectives to Understand Risks in the Electronic Industry, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 20, pp. 542– 547, Dec. 1997. Day, J., Microcontrollers, Electronic Buyers News, April 10, 2000a, CMP Media, http://www.ebnews.com/story/OEG20000406S0011, accessed on January 18, 2002. Day, J., Technology Focus: Microcontrollers, Electronic Buyers News, CMP Media, June 21, 2000b. DEF-STAN-00–71, A Guide to Managing Obsolescence, DEF-STAN-00–71 Issue 1, U.K. Ministry of Defence, London, May 14, 1998. DIN EN 62402, Deutsches Institut fuer Normung e. V. (DIN), Deutsche Norm, DIN EN 62402: 2008: Anleitung zum Obsoleszenzmanagement (IEC 62402:2007); Deutsche Fassung EN 62402:2007. DIN ISO 9004, Deutsches Institut fuer Normung e. V. (DIN), Deutsche Norm, ISO 9004: 2000: Qualitaetsmanagementsysteme-Leitfaden zur Leistungsverbesserung. 2000. DIN, Deutsches Institut fuer Normung e.V., About Us, http://www.din.de/cmd? level=tpl-bereich&menuid=47566&cmsareaid=47566&languageid=en, accessed on November 19, 2010a. DIN, Deutsches Institut fuer Normung e.V., Buy Standards, http://www.din.de/cmd? workflowname=dinSearch&languageid=en, accessed on November 19, 2010b. Directive 1907/2006/EC of the European Parliament and of the Council on the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH), December 18, 2006. Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances (RoHs). January 27, 2003. Directive 2002/96/EC of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE), January 27, 2003. Defense Logistics Agency (DLA), About the Defense Logistics Agency, http://www.dla .mil/about_dla.aspx, accessed on December 5, 2010. Easter, R., VIEWPOINT: Steer Clear of Aftermarket Parts Leprechaun, Military & Aerospace Electronics, May 1, 1994. EIA-4899Standard for Preparing an Electronic Components Management Plan, EIA- 4899, Electronic Industries Alliance, GEIA, Arlington, VA, n.d. EIA-4900, Use of Semiconductor Devices Outside Manufacturers’ Specified Temperature Ranges, EIA-4900, Electronic Industries Alliance, EIA, Arlington, VA, n.d. EIA-724, Product Life-Cycle Data Model, EIA-724, Electronic Industries Alliance, Arlington, VA, September 19, 1997. EIA, GEB1: Diminishing Manufacturing Sources and Material Shortages (DMSMS) Management Practices, EIA, http://www.geia.org/sstc/G12/geb1.html, accessed on January 14, 2002. EIQC-0002, Component Obsolescence Standard, EIQC-0002, Electronics Industry Quality Council, November 1, 1993. Elantec, Press Release: Elantec Semiconductor Announces Military Market Exit, Elantec Semiconductor, July 1, 1997. EN 61025, Europaeisches Komitee fuer Normung, Europaeische Norm, EN 61025: 2007: Fehlzustandsbaumanalyse, 2007. EN ISO 9000, Europaeisches Komitee fuer Normung, Europaeische Norm, EN ISO 9000:2000, Qualitaetsmanagementsysteme—Grundlagen und Begriffe, 2000. FAA, CAST Position Paper P32, Federal Aviation Authority, Washington, DC, May 1, 1999. FABTECH, Semiconductor FABTECH, 1999 Semi Copper-Critical Survey Predicts Copper-Based Semiconductors in Full Production by 2001/02, October 19, 1999, http://www.semiconductorfabtech.com/industry.news/9910/21.17.shtml, accessed on January 29, 2002. Fairchild, Financial Reports/SEC Filings Form 10-K, Fairchild Semiconductors, November 2000, http://www.fairchildsemi.com/company/sec.pdf, accessed on April 17, 2011. Farish, R., EastMeets East, Business Eastern Europe, vol. 24, pp. 17– 19, October 30, 1995. Farrell, N., Techeye.net, 64-bit Windows 7 Software on the Rise on 15.02.1010, http://www.techeye.net/hardware/64-bit-windows-7-software-on-the-rise, accessed on November 23, 2010. Feldman, K., and Sandborn, P., Integrating Technology Obsolescence Considerations into Product Design Planning, Proceedings of the ASME 2007 International Design Engineering Conference & Computers and Information in Engineering Conference, Las Vegas, NV, September, 2007. Feng, D., Singh, P., and Sandborn, P., Lifetime Buy Optimization to Minimize Lifecycle Cost, Proceedings of the 2007 Aging Aircraft Conference, 2007. Finanzen.net, Analog Devices kann Umsatz und Gewinn deutlich steigern, 22.11.2010, http://www.finanzen.net/nachricht/aktien/Analog-Devices-kann-Umsatz-und-Gewinndeutlich- steigern-956667, accessed on December 22, 2010. Fitzhugh, G. L., Rapid Retargeting, A Solution to Electronic Systems Obsolescence, Proceedings of the IEEE 1998 National Aerospace and Electronics Conference (NAECON 1998), pp. 169– 176, 1998. FMEAinfocentre, Process Hazard Analysis, Failure Mode Effects Analysis (FMEA), Rev. 1, 01/15/01, http://www.fmeainfocentre.com/examples/shortintroexample.pdf, accessed on September 27, 2010. Freescale, Life Cycle Stage Codes, Freescale Semiconductors Inc., http://www.freescale .com/webapp/sps/site/eialink.jsp, accessed on March, 20, 2010a. Freescale, Freescale Semiconductors Inc., Support Website on Product Longevity, http://www.freescale.com/webapp/sps/site/overview.jsp?nodeId=0570B0, accessed on October 18, 2010b. Freescale, Freescale Semiconductors Inc., Product Website on ColdFire+ 32bit MCU, http://www.freescale.com/webapp/sps/site/homepage.jsp?code=CFPLUS, accessed on November 22, 2010c. Freescale, Freescale Semiconductors Inc., Website on Thin Film Storage (TFS) with FelxMemory Technology, http://www.freescale.com/webapp/sps/site/overview.jsp? code=TM_RD_PROCESSTECH_90NMTFS_FLXMEM&tid=mcplusHp, accessed on November 22, 2010d. Fyffe, S., Intel Scales Back Rambus Plans, Electronic News, August 14, 2000, Cahners Business Information, http://www.e-insite.net/electronicnews/index.asp?layout= article&articleid=CA50085&pubdate=8/14/2000, accessed on January 15, 2002. Garrett, B., Four Forces Shape DRAM Evolution, EE Times, February 7, 2000, CMP Media, http://www.eetimes.com/story/OEG20000204S0015, accessed on January 16, 2002. GEIA-STD-0002–1 Aerospace Qualified Electronic Component (AQEC) Requirements, Volume 1—Integrated Circuits and Semiconductors, August 2005. Geiger, W., Qualitaetslehre, Einfuehrung, Systematik, Terminologie. 2., voellig neubearbeitete und erweiterte Auflage, Wiesbaden, Friedr. Vieweg & Sohn Verlag, 1994. Geiger, W., Kotte, W., Handbuch Qualitaet, Grundlagen und Elemente des Qualitaetsmanagements: Systeme Perspektiven. 5., vollstaendig ueberarbeitete und erweiterte Auflage. Wiesbaden: Friedr. Vieweg & Sohn Verlag, GWV Fachverlage GmbH. 2008. GIDEP, Government-Industry Data Exchange Program, What Is GIDEP?, http://www .gidep.org/, accessed on April 5, 2010. Gifford, M., High Density Designs Require a New Set of Rules for ASIC Engineers, ASIC Technology & News, March 1, 1990. Giovino, William A., Microcontrollers and DSPs—Will the Two Worlds Ever Intersect?, March 2001, http://www.microcontroller.com/wp/MicrosDSPs/micros_dsps .htm, accessed on January 29, 2002. Gowland A., Managing Software Obsolescence in the COTS Environment, Component Obsolescence Group (COG) Workshop Presentation, November 27, 2002. Gravier, M, and Swartz S. The Dark Side of Innovation: Exploring Obsolescence and Supply Chain Evolution for Sustainment-dominated Systems, Journal of High Technology Management Research, vol. 20, pp. 87– 102, 2009. Harper, C. A., Active Electronic Component Handbook, New York: McGraw-Hill, 1999. Harper, C. A., Jones, H. C., John, M., and Smith, S., Active Electronic Component Handbook, Second Ed., New York: McGraw Hill, 1996. Heise Online, AMD kann Mobilprozessor-Marktanteil leicht steigern, 20.08.2010, www .heise.de/newsticker/meldung/AMD-kann_Mobilprozessor-Marktanteil-leicht-steigern- 1062547.html, accessed on September 21, 2010a. Heise Online, National Semiconductors steigert Umsatz und Gewinn, 10. September 2010, http://www.heise.de/newsticker/meldung/National-Semiconductor-steigert- Umsatz-und-Gewinn-1076911.html, accessed on December 22, 2010b. Helsen, K., and Schmittlein D., Analyzing Duration Times in Marketing: Evidence for the Effectiveness of Hazard Rate Models, Marketing Science, vol. 11, pp. 395– 414, 1993. Henke A., and S. Lai, Automated Parts Obsolescence Prediction, Proceedings of the DMSMS Conference, San Antonio, TX 1997. Herald, T. E., Technology Refreshment Strategy and Plan for Application in Military Systems: A How-to Systems Development Process and Linkage with CAIV, Proc. National Aerospace and Electronics Conference (NAECON), Dayton, OH, pp. 729– 736, October 2000. Hill, D., The Hardware Design Minefield, A Guide to the Electronic Design Process and its Obsolescence Mitigation Strategies, Component Obsolescence Group, United Kingdom, 2007. Hitachi, SRAM Components and Modules Datasheet, Hitachi Semiconductors, July 2000. Hitt, E. F., and Schmidt, J., Technology Obsolescence (TO) Impact on Future Costs, Proceedings of the 17th Digital Avionics Systems Conference (DASC), AIAA/IEEE/SAE, vol. 1, pp. A33– 1–A33–7, 1998. Holzner, D., Zur Wirtschaftlichkeit von Qualitaetsmanagementsystemen, Eine empirische Untersuchung. 01. Auflage, Muenchen, TCW Transfer-Centrum, 2006. Horvath, P., Controlling. 10., vollst. ueberarb. Auflage. Muenchen: Verlag Franz Vahlen, 2006. Howard, M. A., Component Obsolescence. It’s Not Just for Electronics Anymore, ARINC, Annapolis, MD, 2002. HTV, Halbleiter-Test & Vertriebs-GmbH, Testhaus Programmiercenter Langzeitkonservierung, Company Presentation, 2009. Huang, Z., Solomon, R., Sandborn, P., and Pecht, M., Forecasting ASIC Life-Cycles, Future Circuits International, vol. 7, pp. 101– 107, 2001. Huber, J. P., and Rosneck, M.W., Successful ASIC Design the First Time Through, Van Nostrand Reinhold, 1991. Huffman, J. O., Roadblocks in SRAM Future, Electronic News, Cahners Business Information, June 1998. Humphrey, D., Condra, L., Pendse, N., Das, D., Wilkinson, C., and Pecht, M., An Avionics Guide to Uprating of Electronic Parts, IEEE Transactions on Components and Packaging Technologies, vol. 23, pp. 595– 599, Sept. 1, 2000. Hynix Semiconductor, Inc., Product Overview, http://www.hynix.com/gl/products/index.jsp?menuNo=1&m=0&s=0, accessed on February 11, 2010. IEC-62239, Electronic Component Management Plans, PAS Pre-standard 62239, International Electrotechnical Committee, Geneva, Switzerland, April 1, 2001. IEC-62240, Use of Semiconductor Devices Outside Manufacturer Specified Temperature Ranges, PAS Pre-standard 62240, International Electroctechnical Committee, April 1, 2001. IEC-62402, IEC 62402 Ed. 1.0: Guide to Managing Obsolescence, Committee Draft (CD), International Electrotechnical Commission, IEC, 2004. IEC-62435, International Electrotechnical Commission, IEC 62435: Electronic Components— Long-duration Storage of Electronic Components, n.d. IEC, IEC, About the IEC, http://www.iec.ch/helpline/sitetree/about/, accessed on November 19, 2010. Intel, 1998 Annual Report, Intel Corporation, 1998. Intel, 1999 Annual Report, Intel Corporation, 1999. Intel, Product Marketing Change of Embedded Pentium II Processor Low Power Module at 333 MHz and 256K L2 Cache on Die, PCN #1068–00, Intel Corporation, December 12, 2000a. Intel, Intel Flash Memory Package Topside Lasermark Change for All EasyBGA Packages, PCN #932, Intel Corporation, February 18, 2000b. Product Change Notification #109885–00, Selected Embeded Processor, Product Discontinuance, Intel Xeon Processor L3014, Intel Corporation, March 18, 2010a. Intel Corporation, Moore’s Law 40th Anniversary, http://www.intel.com/pressroom/kits/events/moores_law_40th/, 2010b, accessed on April, 18, 2011. Intel Corporation, Product Website on Intel Atom Z500, http://ark.intel.com/Product .aspx?id=35472, accessed on November 23, 2010c. Intel Corporation, Product Website on Architecture and Silicon Technology, http://www.intel.com/technology/architecture-silicon/index.htm, accessed on November 23, 2010d. Intel Corp., Press Kit Moore’s Law 40th Anniversary, http://www.intel.com/pressroom/kits/events/moores_law_40th/index.htm, accessed on November 30, 2010e. Intel Corp., Information on Technology Website, http://www.intel.com/technology/manufacturing/index.htm?iid=subhdr-DE+tech_mfg, accessed on December 26, 2010f. IT-Times, Texas Instruments blickt zuversichtlich ins neue Jahr. hohe Nachfrage nach Smartphone-Chips sorgt fuer gute Geschaefte, http://www.it-times.de/news/nachricht/datum/2010/12/08/texas-instruments-blickt-zuversichtlich-ins-neuejahr- hohe-nachfrage-nach-smartphone-chips-sorgt-f/?cHash=6959feed61&type=98, accessed on December 21, 2010. Jackson, M., Sandborn, P., Pecht, M., Hemens-Davis, C., and Audette, P., A Risk- Informed Methodology for Parts Selection and Management, Quality and Reliability Engineering International, vol. 15, pp. 261– 271, 1999. JESD46A, Guidelines for User Notification of Product/Process Changes by Semiconductor Suppliers, JESD46A, Electronic Industries Alliance, Arlington, VA, April 1, 1994. JESD48, Product Discontinuance, JESD48, Electronics Industry Association, Arlington, VA, September 1, 1997. JESD53, Management of Component Obsolescence by Government Contractors, JESD53, Electronics Industry Association, Arlington, VA, January 1, 1996. John, M., and Smith, S., Application-Specific Integrated Circuits, Addison-Wesley, 1997. Johnson, G., Flash Memory Sales Soar, Electronic News, June 19, 2000, Cahners Business Information, http://www.e-insite.net/electronicnews/index.asp?layout= article&articleid=CA4967" @default.
- W4211034791 created "2022-02-13" @default.
- W4211034791 date "2012-04-09" @default.
- W4211034791 modified "2023-09-26" @default.
- W4211034791 title "References" @default.
- W4211034791 cites W1549125604 @default.
- W4211034791 cites W1995061352 @default.
- W4211034791 cites W2014362973 @default.
- W4211034791 cites W2025207026 @default.
- W4211034791 cites W2034990006 @default.
- W4211034791 cites W2047934477 @default.
- W4211034791 cites W2062088818 @default.
- W4211034791 cites W2062585460 @default.
- W4211034791 cites W2065860205 @default.
- W4211034791 cites W2066467959 @default.
- W4211034791 cites W2090143388 @default.
- W4211034791 cites W2090587217 @default.
- W4211034791 cites W2099310602 @default.
- W4211034791 cites W2100051861 @default.
- W4211034791 cites W2110163174 @default.
- W4211034791 cites W2115656051 @default.
- W4211034791 cites W2117836241 @default.
- W4211034791 cites W2119785455 @default.
- W4211034791 cites W2123574711 @default.
- W4211034791 cites W2124255772 @default.
- W4211034791 cites W2130351314 @default.
- W4211034791 cites W2138441309 @default.
- W4211034791 cites W2142934037 @default.
- W4211034791 cites W2144740017 @default.
- W4211034791 cites W2147760802 @default.
- W4211034791 cites W2149559708 @default.
- W4211034791 cites W2154763142 @default.
- W4211034791 cites W2156560404 @default.
- W4211034791 cites W2159251212 @default.
- W4211034791 cites W2162800725 @default.
- W4211034791 cites W2166646215 @default.
- W4211034791 cites W4298432374 @default.
- W4211034791 doi "https://doi.org/10.1002/9781118275474.refs" @default.
- W4211034791 hasPublicationYear "2012" @default.
- W4211034791 type Work @default.
- W4211034791 citedByCount "0" @default.
- W4211034791 crossrefType "other" @default.
- W4211034791 hasConcept C41008148 @default.
- W4211034791 hasConceptScore W4211034791C41008148 @default.
- W4211034791 hasLocation W42110347911 @default.
- W4211034791 hasOpenAccess W4211034791 @default.
- W4211034791 hasPrimaryLocation W42110347911 @default.
- W4211034791 hasRelatedWork W1596801655 @default.
- W4211034791 hasRelatedWork W2130043461 @default.
- W4211034791 hasRelatedWork W2350741829 @default.
- W4211034791 hasRelatedWork W2358668433 @default.
- W4211034791 hasRelatedWork W2376932109 @default.
- W4211034791 hasRelatedWork W2382290278 @default.
- W4211034791 hasRelatedWork W2390279801 @default.
- W4211034791 hasRelatedWork W2748952813 @default.
- W4211034791 hasRelatedWork W2899084033 @default.
- W4211034791 hasRelatedWork W2530322880 @default.
- W4211034791 isParatext "false" @default.
- W4211034791 isRetracted "false" @default.
- W4211034791 workType "other" @default.