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• W4213244292 endingPage "1790" @default.
• W4213244292 startingPage "1780" @default.
• W4213244292 abstract "The wetting interface of Ag–Cu–Ti alloy on Si 3 N 4 ceramic was researched by the sessile drop method, and a uniform TiN–Ti 5 Si 3 mixed layer of ˜ μ m was formed at the interface. The work of adhesion ( W a ), interfacial energy and electronic properties of Ag(111)/Si 3 N 4 (0001), Ag(111)/TiN(111) and Ag(111)/Ti 5 Si 3 (0001) interfaces were studied by DFT calculations to investigated the mechanisms lying behind the excellent bonding strength of Ag–Cu–Ti/Si 3 N 4 wetting system. The computational outcome shows that the Ag(111)/N-terminated TiN(111) interface presents the maximum W a , and the interfacial energy of the Ag(111)/Si 3 N 4 (0001) interface is higher than those of the Ag(111)/TiN(111) and Ag(111)/Ti 5 Si 3 (0001) interfaces, indicating that the TiN–Ti 5 Si 3 mixed layer formed at the interface does play a positively role in enhancing the interfacial strength of Ag–Cu–Ti alloy on Si 3 N 4 ceramics. And the electronic properties reveal that an existence of charge transfer between Ag and N atoms leads to the ionic bond formation at the Ag/AlN interface." @default.
• W4213244292 created "2022-02-24" @default.
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• W4213244292 date "2021-11-01" @default.
• W4213244292 modified "2023-09-28" @default.
• W4213244292 title "Theoretical Investigations on Interfacial Behavior of Ag–Cu–Ti/Si₃N₄ Wetting System" @default.
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• W4213244292 doi "https://doi.org/10.1166/jno.2021.3111" @default.
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