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- W42139952 abstract "An InP DHBT process technology implementing commercial carbon-doped epitaxial structures has been developed and characterized in a high volume 4-inch wafer production line. This HBT technology utilizes non-self aligned emitter and base contacts, InP emitter, selective etch stop layers and optimized base-collector junction grading profile for enhanced manufacturability and performance. The availability of high quality and stable InP-based commercial epitaxial materials has greatly shortened the process development time. Our InP DHBTs exhibit very low knee voltage of 0.5V at 100 kA/cm 2 with peak ft= 160 GHz and peak fmax of 190GHz. A SPICE-like large signal model is also discussed in this paper. Following the successful pattern of its GaAs HBT counterpart, we believe a low cost, high yield and manufacturable 4-inch InP HBT production will become a reality soon." @default.
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- W42139952 date "2002-01-01" @default.
- W42139952 modified "2023-09-26" @default.
- W42139952 title "A Non-Self Aligned InP HBT Production Process" @default.
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