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- W4220838950 abstract "Electronic yarns (E-yarns) are a type of electronic textile where the electronics are embedded within the yarn structure, resulting in a yarn with normal textile properties. This is achieved by soldering thin copper wires onto electronic components, encapsulating the component within a UV-curable resin micro-pod, and covering the component with reinforcing yarns. The resin micro-pod protects both the component and the solder joints, providing the final yarn strength along its main axis: this is critical for its reliability after post-processing and during use. This work explored the use of Finite-Element Analysis to evaluate the mechanical stresses at the soldered joints of the core structure of E-yarns under axial loading before and after the encapsulation of the component. The results of this analysis were compared to the tensile test results of the core structure of the E-yarn." @default.
- W4220838950 created "2022-04-03" @default.
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- W4220838950 date "2022-03-09" @default.
- W4220838950 modified "2023-09-25" @default.
- W4220838950 title "Finite-Element Analysis of the Mechanical Stresses on the Core Structure of Electronically Functional Yarns" @default.
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- W4220838950 doi "https://doi.org/10.3390/engproc2022015002" @default.
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