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- W4221003175 abstract "Contemporary thermoelectric literature is rife with material structure-related terminologies like interfaces and grain boundaries, signaling the significance of these structures. Interfaces decide the characteristics of electronic and thermal transport and mechanical properties of polycrystalline and nano thermoelectric (TE) materials. Understanding the relationship between grain boundaries/interphase boundaries and property connections in materials is a key component of material design with desired characteristics and performance. It is now widely recognized that the microstructure of materials is intimately connected to their bulk properties. Accordingly, microstructure control and interface manipulation have emerged as critical topics in the field of materials science and engineering, particularly in thermoelectrics. This paper narrates recent breakthroughs in high-performance TE material design from the standpoints of interface structure and grain boundary manipulation. First, it provides a glimpse of strategies for thermal conductivity reduction through nano and microstructure control, embedded nanoinclusions, grain size reduction, and all-scale hierarchical architectures. It then deliberates on electron and phonon transport decoupling via coherent interfaces, matrix/precipitate electronic band alignment, and charge carrier filtering effects. It proceeds to review the recent results on TE properties of materials prepared with aforementioned strategies emphasizing Bi2(Te,Se)3 and (Bi,Sb)2Te3, SnSe, SnTe, Cu2Se, skutterudides, PbTe-based compounds, GeTe, polymer TE composites, and other materials. At the end, possible strategies for further enhancing zT are addressed." @default.
- W4221003175 created "2022-04-03" @default.
- W4221003175 creator A5084075297 @default.
- W4221003175 date "2022-03-25" @default.
- W4221003175 modified "2023-10-18" @default.
- W4221003175 title "Imprints of interfaces in thermoelectric materials" @default.
- W4221003175 cites W1490576103 @default.
- W4221003175 cites W1519210049 @default.
- W4221003175 cites W1537517951 @default.
- W4221003175 cites W1581620547 @default.
- W4221003175 cites W1606101578 @default.
- W4221003175 cites W1639599732 @default.
- W4221003175 cites W1646777900 @default.
- W4221003175 cites W1649566699 @default.
- W4221003175 cites W1649920594 @default.
- W4221003175 cites W1656225907 @default.
- W4221003175 cites W1677357213 @default.
- W4221003175 cites W1684284138 @default.
- W4221003175 cites W1742101097 @default.
- W4221003175 cites W1751707378 @default.
- W4221003175 cites W1765103927 @default.
- W4221003175 cites W1810941564 @default.
- W4221003175 cites W1843569683 @default.
- W4221003175 cites W1863958560 @default.
- W4221003175 cites W1905330982 @default.
- W4221003175 cites W1954017517 @default.
- W4221003175 cites W1963802447 @default.
- W4221003175 cites W1964974854 @default.
- W4221003175 cites W1965905995 @default.
- W4221003175 cites W1968230063 @default.
- W4221003175 cites W1968460660 @default.
- W4221003175 cites W1968846510 @default.
- W4221003175 cites W1971366629 @default.
- W4221003175 cites W1972855028 @default.
- W4221003175 cites W1973549151 @default.
- W4221003175 cites W1973661872 @default.
- W4221003175 cites W1974142977 @default.
- W4221003175 cites W1976293075 @default.
- W4221003175 cites W1976380240 @default.
- W4221003175 cites W1977147427 @default.
- W4221003175 cites W1980527175 @default.
- W4221003175 cites W1980821031 @default.
- W4221003175 cites W1986576442 @default.
- W4221003175 cites W1986625735 @default.
- W4221003175 cites W1987066794 @default.
- W4221003175 cites W1987090462 @default.
- W4221003175 cites W1989193736 @default.
- W4221003175 cites W1991859775 @default.
- W4221003175 cites W1992459020 @default.
- W4221003175 cites W1993684313 @default.
- W4221003175 cites W1994624727 @default.
- W4221003175 cites W1995952816 @default.
- W4221003175 cites W1996613237 @default.
- W4221003175 cites W1997306715 @default.
- W4221003175 cites W1997397142 @default.
- W4221003175 cites W1998075234 @default.
- W4221003175 cites W1998693739 @default.
- W4221003175 cites W1999456562 @default.
- W4221003175 cites W1999725721 @default.
- W4221003175 cites W2000949364 @default.
- W4221003175 cites W2002504014 @default.
- W4221003175 cites W2004291543 @default.
- W4221003175 cites W2004378275 @default.
- W4221003175 cites W2004917518 @default.
- W4221003175 cites W2005939536 @default.
- W4221003175 cites W2007206010 @default.
- W4221003175 cites W2007337806 @default.
- W4221003175 cites W2007963577 @default.
- W4221003175 cites W2008105830 @default.
- W4221003175 cites W2008375944 @default.
- W4221003175 cites W2009867961 @default.
- W4221003175 cites W2010971702 @default.
- W4221003175 cites W2011229463 @default.
- W4221003175 cites W2012577355 @default.
- W4221003175 cites W2013073809 @default.
- W4221003175 cites W2013964280 @default.
- W4221003175 cites W2016581939 @default.
- W4221003175 cites W2017871657 @default.
- W4221003175 cites W2018740369 @default.
- W4221003175 cites W2018931567 @default.
- W4221003175 cites W2019099494 @default.
- W4221003175 cites W2021994802 @default.
- W4221003175 cites W2023499447 @default.
- W4221003175 cites W2024450502 @default.
- W4221003175 cites W2025300775 @default.
- W4221003175 cites W2027139235 @default.
- W4221003175 cites W2027314252 @default.
- W4221003175 cites W2027563442 @default.
- W4221003175 cites W2029741576 @default.
- W4221003175 cites W2030579991 @default.
- W4221003175 cites W2030650018 @default.
- W4221003175 cites W2031005055 @default.
- W4221003175 cites W2036461529 @default.
- W4221003175 cites W2039396222 @default.
- W4221003175 cites W2040423180 @default.
- W4221003175 cites W2041179822 @default.
- W4221003175 cites W2041532378 @default.
- W4221003175 cites W2041837364 @default.