FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W4225136957> ?p ?o ?g. }

• W4225136957 abstract "Power semiconductor device architectures require the inclusion of a diffusion barrier to suppress, or at best prevent the interdiffusion between the copper metallisation interconnects and the surrounding silicon substructure. The binary pseudo-alloy of titanium-tungsten (TiW), with $>$70~at.% W, is a well established copper diffusion barrier but is prone to degradation via the out-diffusion of titanium when exposed to high temperatures ($geq$400$^circ$C). Here, the thermal stability of physical vapour deposited (PVD) TiW/Cu bilayer thin films in Si/SiOtextsubscript{2}(50~nm)/TiW(300~nm)/Cu(25~nm) stacks were characterised in response to annealing at 400$^circ$C for 0.5~h and 5~h, using a combination of soft and hard X-ray photoelectron spectroscopy (SXPS and HAXPES) and transmission electron microscopy (TEM). Results show that annealing promoted the segregation of titanium out of the TiW and interdiffusion into the copper metallisation. Titanium was shown be driven toward the free copper surface, accumulating there and forming a titanium oxide overlayer upon exposure to air. Annealing for longer timescales promoted a greater out-diffusion of titanium and a thicker oxide layer to grow on the copper surface. However, interface measurements suggest that the diffusion is not significant enough to compromise the barrier integrity and the TiW/Cu interface remains stable even after 5~h of annealing." @default.
• W4225136957 created "2022-05-01" @default.
• W4225136957 creator A5016333937 @default.
• W4225136957 creator A5021494937 @default.
• W4225136957 creator A5035273524 @default.
• W4225136957 creator A5048687579 @default.
• W4225136957 creator A5056443409 @default.
• W4225136957 creator A5061264765 @default.
• W4225136957 creator A5070983242 @default.
• W4225136957 creator A5071234455 @default.
• W4225136957 creator A5071328113 @default.
• W4225136957 creator A5086623549 @default.
• W4225136957 date "2022-04-28" @default.
• W4225136957 modified "2023-09-26" @default.
• W4225136957 title "Evaluation of the thermal stability of TiW/Cu heterojunctions using a combined SXPS and HAXPES approach" @default.
• W4225136957 cites W1128414314 @default.
• W4225136957 cites W1597355861 @default.
• W4225136957 cites W1965247097 @default.
• W4225136957 cites W1969969547 @default.
• W4225136957 cites W1972521324 @default.
• W4225136957 cites W1974679568 @default.
• W4225136957 cites W1975658814 @default.
• W4225136957 cites W1979450407 @default.
• W4225136957 cites W1981270473 @default.
• W4225136957 cites W1983199452 @default.
• W4225136957 cites W1986839562 @default.
• W4225136957 cites W1987982357 @default.
• W4225136957 cites W1988375063 @default.
• W4225136957 cites W1988594650 @default.
• W4225136957 cites W1989096179 @default.
• W4225136957 cites W1989597440 @default.
• W4225136957 cites W1995314163 @default.
• W4225136957 cites W1998260542 @default.
• W4225136957 cites W2002651922 @default.
• W4225136957 cites W2006558980 @default.
• W4225136957 cites W2011987856 @default.
• W4225136957 cites W2012418901 @default.
• W4225136957 cites W2013476338 @default.
• W4225136957 cites W2013830242 @default.
• W4225136957 cites W2017062950 @default.
• W4225136957 cites W2017435694 @default.
• W4225136957 cites W2019112259 @default.
• W4225136957 cites W2021627812 @default.
• W4225136957 cites W2021681681 @default.
• W4225136957 cites W2024317176 @default.
• W4225136957 cites W2024500233 @default.
• W4225136957 cites W2024533005 @default.
• W4225136957 cites W2032623280 @default.
• W4225136957 cites W2033064663 @default.
• W4225136957 cites W2033729674 @default.
• W4225136957 cites W2034870666 @default.
• W4225136957 cites W2035485730 @default.
• W4225136957 cites W2036886129 @default.
• W4225136957 cites W2037252281 @default.
• W4225136957 cites W2048834864 @default.
• W4225136957 cites W2052069836 @default.
• W4225136957 cites W2053902070 @default.
• W4225136957 cites W2055074212 @default.
• W4225136957 cites W2055740220 @default.
• W4225136957 cites W2057050977 @default.
• W4225136957 cites W2058193496 @default.
• W4225136957 cites W2058227570 @default.
• W4225136957 cites W2060316886 @default.
• W4225136957 cites W2062408714 @default.
• W4225136957 cites W2063329807 @default.
• W4225136957 cites W2066244156 @default.
• W4225136957 cites W2073713272 @default.
• W4225136957 cites W2081985619 @default.
• W4225136957 cites W2082904827 @default.
• W4225136957 cites W2089599484 @default.
• W4225136957 cites W2090721423 @default.
• W4225136957 cites W2091684628 @default.
• W4225136957 cites W2091779828 @default.
• W4225136957 cites W2093008376 @default.
• W4225136957 cites W2093515408 @default.
• W4225136957 cites W2114315636 @default.
• W4225136957 cites W2126646238 @default.
• W4225136957 cites W2143197834 @default.
• W4225136957 cites W2152206793 @default.
• W4225136957 cites W2155072362 @default.
• W4225136957 cites W2158882646 @default.
• W4225136957 cites W2172232804 @default.
• W4225136957 cites W2299467893 @default.
• W4225136957 cites W2332095368 @default.
• W4225136957 cites W2515579493 @default.
• W4225136957 cites W2586699375 @default.
• W4225136957 cites W2807937510 @default.
• W4225136957 cites W2884028266 @default.
• W4225136957 cites W2980466256 @default.
• W4225136957 cites W3133763546 @default.
• W4225136957 cites W3161765886 @default.
• W4225136957 cites W3200520313 @default.
• W4225136957 cites W3207910183 @default.
• W4225136957 cites W3208616802 @default.
• W4225136957 doi "https://doi.org/10.1063/5.0086009" @default.
• W4225136957 hasPublicationYear "2022" @default.
• W4225136957 type Work @default.
• W4225136957 citedByCount "2" @default.
• W4225136957 countsByYear W42251369572022 @default.
• W4225136957 countsByYear W42251369572023 @default.

• next