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- W4225311931 abstract "Contacts stability versus thermal budget is a major concern in 3D sequential integration. We experimentally investigate the thermal stability of n-type contacts on Si and p-type contacts on SiGe in terms of specific contact resistivity (ρ <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>c</inf> ). An improved ρ <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>cn</inf> performance featuring lower magnitude and better thermal stability has been demonstrated for Ti silicide contacts on n <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>+</sup> -Si with Ge pre-amorphization implantation (PAI). For p-type contacts, it is found that Ni has lost its high work function advantage on p <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>++</sup> -SiGe and Ti germanosilicide contacts show ρ <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>cp</inf> outperformance. CMOS contact scheme based on single Ti instead of dual Ti and Ni has hence been evidenced to be more suitable for 3D sequential integration." @default.
- W4225311931 created "2022-05-05" @default.
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- W4225311931 date "2022-03-01" @default.
- W4225311931 modified "2023-09-27" @default.
- W4225311931 title "Investigation on Contacts Thermal Stability for 3D Sequential Integration" @default.
- W4225311931 doi "https://doi.org/10.1109/irps48227.2022.9764471" @default.
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