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• W4229011193 startingPage "109085" @default.
• W4229011193 abstract "The effect of H+ implantation and annealing of diamond (100) monocrystalline substrates has been studied by ToF-SIMS, cathodoluminescence, transmission spectroscopy and TEM. Blistering conditions suitable for the Smart Cut™ technology have been identified in monocrystalline diamond, using two sets of hydrogen implantation and annealing. A first hydrogen implantation followed by a first annealing leads to amorphization of a buried layer without hydrogen exodiffusion. Blisters and exfoliations appear at the surface of the diamond samples, after a second hydrogen implantation inside the pre-amorphized diamond layer and a final annealing, as evidenced by TEM and optical microscopy. Demonstration of hydrogen-induced blistering is a major step to adapt the Smart Cut™ process on diamond material. This process is compatible with wafer bonding before the second annealing and therefore open the way for thin diamond layer transfer on a bonded receiver wafer, still not achieved to date." @default.
• W4229011193 created "2022-05-08" @default.
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• W4229011193 date "2022-06-01" @default.
• W4229011193 modified "2023-10-16" @default.
• W4229011193 title "Hydrogen implantation-induced blistering in diamond: Toward diamond layer transfer by the Smart Cut™ technique" @default.
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• W4229011193 doi "https://doi.org/10.1016/j.diamond.2022.109085" @default.
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