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- W4229041212 abstract "This paper addresses the problem of performance and thermal yield maximization for hard real-time 3D embedded chip multiprocessors. We propose a process variation-aware method that simultaneously performs die packing, die matching and static thread mapping by using design-time characteristics of the target hard real-time embedded application and the manufactured dies. To the best of our knowledge, this work is the first attempt to formulate die packing, die matching and static thread mapping as a single design-time yield maximization problem. Experimental results of applying our proposed method and several baselines on real-world benchmarks show that our method could achieve 27% yield improvement on average and up to 2.3x improvement at maximum compared to the best-performing baseline." @default.
- W4229041212 created "2022-05-08" @default.
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- W4229041212 date "2022-07-01" @default.
- W4229041212 modified "2023-09-30" @default.
- W4229041212 title "Yield-aware joint die packing, die matching and static thread mapping for hard real-time 3D embedded CMPs" @default.
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- W4229041212 doi "https://doi.org/10.1016/j.micpro.2022.104543" @default.
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