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• W4229064089 endingPage "232" @default.
• W4229064089 startingPage "219" @default.
• W4229064089 abstract "During the electrochemical discharge machining (ECDM) process, major imperfections on work material occurs due to stray cutting caused by thermal energy. Some of these are re-solidification, melt flow over, thermal splashes, micro-cracks, work material breakage, hole over cut (HOC), and sudden taper. These thermal deteriorations are inherent in thermal-based processes like the ECDM process. Post-processing of these machined features at micron-level on glass material is a challenging task. To overcome this issue, in the present article, the depth up to which thermal damages occurred was predicted at given input energy conditions and the same thickness of glass wafer was bonded over the work material during machining. In order to find out the thickness, a pressurized tool feeding and dial gauge attachment was designed. Using this attachment, instantaneous depth was measured at every second of machining time and effective energy supplied to each plane of the work material was calculated analytically. The same was imported in to COMSOL Multiphysics software for simulating the heat flux gradient and temperature distribution on each plane of the work material. Using the simulation data, the depths from the hole entrance that are more prone to thermal deteriorations was identified. This depth was considered as critical depth for respective input energy conditions. Applied voltage, pulse on time, and glass wafer thickness were considered as input parametric conditions, and machined hole depth, HOC, and hole quality on work material were considered as output characteristics. Experiments were performed with various parametric conditions, and it was observed that the glass wafer carried away the major thermal deteriorations and leaving minimal damages on the work material. At the optimal parametric conditions, HOC was reduced by 71.5% and hole quality was improved significantly. Application of glass wafer compromises around 39% hole depth." @default.
• W4229064089 created "2022-05-08" @default.
• W4229064089 creator A5075038825 @default.
• W4229064089 creator A5084998438 @default.
• W4229064089 date "2022-07-01" @default.
• W4229064089 modified "2023-09-30" @default.
• W4229064089 title "On the use of sacrificial layer in ECDM process for form accuracy" @default.
• W4229064089 cites W1595435094 @default.
• W4229064089 cites W2007079597 @default.
• W4229064089 cites W2024861082 @default.
• W4229064089 cites W2050888218 @default.
• W4229064089 cites W2057616717 @default.
• W4229064089 cites W2071311642 @default.
• W4229064089 cites W2083644680 @default.
• W4229064089 cites W2087106278 @default.
• W4229064089 cites W2224268334 @default.
• W4229064089 cites W2295005477 @default.
• W4229064089 cites W2562161923 @default.
• W4229064089 cites W2622818138 @default.
• W4229064089 cites W2800154928 @default.
• W4229064089 cites W2886554614 @default.
• W4229064089 cites W2899359885 @default.
• W4229064089 cites W2967749786 @default.
• W4229064089 cites W2972777590 @default.
• W4229064089 cites W2979659993 @default.
• W4229064089 cites W3000974119 @default.
• W4229064089 cites W3103737126 @default.
• W4229064089 cites W3111246538 @default.
• W4229064089 cites W3120147460 @default.
• W4229064089 cites W4221094300 @default.
• W4229064089 doi "https://doi.org/10.1016/j.jmapro.2022.04.043" @default.
• W4229064089 hasPublicationYear "2022" @default.
• W4229064089 type Work @default.
• W4229064089 citedByCount "7" @default.
• W4229064089 countsByYear W42290640892022 @default.
• W4229064089 countsByYear W42290640892023 @default.
• W4229064089 crossrefType "journal-article" @default.
• W4229064089 hasAuthorship W4229064089A5075038825 @default.
• W4229064089 hasAuthorship W4229064089A5084998438 @default.
• W4229064089 hasConcept C121332964 @default.
• W4229064089 hasConcept C127413603 @default.
• W4229064089 hasConcept C135628077 @default.
• W4229064089 hasConcept C153294291 @default.
• W4229064089 hasConcept C159188206 @default.
• W4229064089 hasConcept C159985019 @default.
• W4229064089 hasConcept C160671074 @default.
• W4229064089 hasConcept C18762648 @default.
• W4229064089 hasConcept C191897082 @default.
• W4229064089 hasConcept C192562407 @default.
• W4229064089 hasConcept C204530211 @default.
• W4229064089 hasConcept C46435376 @default.
• W4229064089 hasConcept C49040817 @default.
• W4229064089 hasConcept C50517652 @default.
• W4229064089 hasConcept C523214423 @default.
• W4229064089 hasConcept C57879066 @default.
• W4229064089 hasConcept C66938386 @default.
• W4229064089 hasConcept C78519656 @default.
• W4229064089 hasConceptScore W4229064089C121332964 @default.
• W4229064089 hasConceptScore W4229064089C127413603 @default.
• W4229064089 hasConceptScore W4229064089C135628077 @default.
• W4229064089 hasConceptScore W4229064089C153294291 @default.
• W4229064089 hasConceptScore W4229064089C159188206 @default.
• W4229064089 hasConceptScore W4229064089C159985019 @default.
• W4229064089 hasConceptScore W4229064089C160671074 @default.
• W4229064089 hasConceptScore W4229064089C18762648 @default.
• W4229064089 hasConceptScore W4229064089C191897082 @default.
• W4229064089 hasConceptScore W4229064089C192562407 @default.
• W4229064089 hasConceptScore W4229064089C204530211 @default.
• W4229064089 hasConceptScore W4229064089C46435376 @default.
• W4229064089 hasConceptScore W4229064089C49040817 @default.
• W4229064089 hasConceptScore W4229064089C50517652 @default.
• W4229064089 hasConceptScore W4229064089C523214423 @default.
• W4229064089 hasConceptScore W4229064089C57879066 @default.
• W4229064089 hasConceptScore W4229064089C66938386 @default.
• W4229064089 hasConceptScore W4229064089C78519656 @default.
• W4229064089 hasLocation W42290640891 @default.
• W4229064089 hasOpenAccess W4229064089 @default.
• W4229064089 hasPrimaryLocation W42290640891 @default.
• W4229064089 hasRelatedWork W2063110400 @default.
• W4229064089 hasRelatedWork W2089272106 @default.
• W4229064089 hasRelatedWork W2296531415 @default.
• W4229064089 hasRelatedWork W2359343347 @default.
• W4229064089 hasRelatedWork W2374818677 @default.
• W4229064089 hasRelatedWork W2393634774 @default.
• W4229064089 hasRelatedWork W2475769021 @default.
• W4229064089 hasRelatedWork W2802185866 @default.
• W4229064089 hasRelatedWork W2969854442 @default.
• W4229064089 hasRelatedWork W52110524 @default.
• W4229064089 hasVolume "79" @default.
• W4229064089 isParatext "false" @default.
• W4229064089 isRetracted "false" @default.
• W4229064089 workType "article" @default.