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• W4229682368 startingPage "291" @default.
• W4229682368 abstract "During microsystem fabrication, distortions or alterations in the atoms' positions are introduced when different materials are coupled, or even when the same material is used, because of different deposition techniques adopted for each layer. A nonzero initial stress configuration (i.e. before any external action is applied) is therefore obtained; in most cases, this condition entails undesired consequences, such as excessive strains, thin-film delamination or buckling and, in general, unforeseen changes in the microstructure. This chapter addresses the effects of the residual stress, from the point of view of the MEMS mechanical designer than from the scientist interpreting their physical or technological causes, such as how they arise in a manufacturing process. Many experimental approaches have been envisaged to determine the residual stresses in materials; limiting the discussion to microsystems, one can distinguish between methods for thin films on substrates, for free-standing films and for the characterization of residual stresses induced by the packaging." @default.
• W4229682368 created "2022-05-11" @default.
• W4229682368 date "2018-02-05" @default.
• W4229682368 modified "2023-10-14" @default.
• W4229682368 title "Fabrication‐Induced Residual Stresses and Relevant Failures" @default.
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• W4229682368 doi "https://doi.org/10.1002/9781119053828.ch14" @default.
• W4229682368 hasPublicationYear "2018" @default.
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