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- W4230291231 abstract "Abstract At micro scale, thermal actuation provides larger forces and is easier to control compared to the widely used electrostatic actuation. In this paper, we highlight a third advantage of thermal actuation viz. the ease with which it can be utilized to achieve a novel embedded electro-thermal-compliant (ETC) actuation for MEMS. A number of novel ETC building blocks and devices are described and their analysis and design issues are discussed. The devices were microfabricated using MCNC’s MUMPs foundry process as well as a bulk-micromachining process called PennSOIL (Penn Silicon-On-Insulator Layer). Experimental measurements are presented and reasons for discrepancies with the theoretical predictions are discussed." @default.
- W4230291231 created "2022-05-11" @default.
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- W4230291231 date "1999-11-14" @default.
- W4230291231 modified "2023-09-27" @default.
- W4230291231 title "Micromechanical Devices With Embedded Electro-Thermal-Compliant Actuation" @default.
- W4230291231 doi "https://doi.org/10.1115/imece1999-0320" @default.
- W4230291231 hasPublicationYear "1999" @default.
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