Matches in SemOpenAlex for { <https://semopenalex.org/work/W4236042998> ?p ?o ?g. }
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- W4236042998 endingPage "764" @default.
- W4236042998 startingPage "758" @default.
- W4236042998 abstract "Multichip modules provide shorter interconnection lengths between the chips, higher speeds and lower costs. This higher system performance is the driving force for advances in MCM packaging technology. A potential limitation is the ability to remove heat from these packages. With higher chip densities, the thermal management of multichip modules poses a real challenge to the package manufacturer. There is a need to define the junction-to-ambient and junction-to-case thermal resistances for multichip modules in a more rigorous manner while reducing the number of thermal tests needed to evaluate an MCM and provide information to predict junction temperatures under arbitrary powering up of the individual dice. For high reliability, it is critical that maximum specified operating junction temperatures are not exceeded. Experiments were performed for nonuniform powering up of an MCM mounted on a vertical board in natural and forced convection. The package tested was a 208-lead Amkor PMCM. The average chip temperature due to multiple sources within the module was considered as the reference temperature for evaluating the junction temperature rise of the particular chip. The concept of superposition of temperatures was found to capture the effect of the background heating of the chip due to its neighbors as well as the individual power dissipation from the chip in question. This approach offers a more refined methodology for evaluation of nonuniformly powered multichip modules compared to previous methods." @default.
- W4236042998 created "2022-05-12" @default.
- W4236042998 creator A5008121867 @default.
- W4236042998 creator A5022557429 @default.
- W4236042998 creator A5039559790 @default.
- W4236042998 date "1995-01-01" @default.
- W4236042998 modified "2023-10-14" @default.
- W4236042998 title "Methodology for thermal evaluation of multichip modules" @default.
- W4236042998 doi "https://doi.org/10.1109/95.477461" @default.
- W4236042998 hasPublicationYear "1995" @default.
- W4236042998 type Work @default.
- W4236042998 citedByCount "15" @default.
- W4236042998 countsByYear W42360429982013 @default.
- W4236042998 countsByYear W42360429982014 @default.
- W4236042998 countsByYear W42360429982016 @default.
- W4236042998 countsByYear W42360429982017 @default.
- W4236042998 countsByYear W42360429982019 @default.
- W4236042998 countsByYear W42360429982020 @default.
- W4236042998 countsByYear W42360429982021 @default.
- W4236042998 crossrefType "journal-article" @default.
- W4236042998 hasAuthorship W4236042998A5008121867 @default.
- W4236042998 hasAuthorship W4236042998A5022557429 @default.
- W4236042998 hasAuthorship W4236042998A5039559790 @default.
- W4236042998 hasConcept C114834414 @default.
- W4236042998 hasConcept C119599485 @default.
- W4236042998 hasConcept C120793396 @default.
- W4236042998 hasConcept C121332964 @default.
- W4236042998 hasConcept C123745756 @default.
- W4236042998 hasConcept C126233035 @default.
- W4236042998 hasConcept C127413603 @default.
- W4236042998 hasConcept C135402231 @default.
- W4236042998 hasConcept C137693562 @default.
- W4236042998 hasConcept C153294291 @default.
- W4236042998 hasConcept C159985019 @default.
- W4236042998 hasConcept C163258240 @default.
- W4236042998 hasConcept C165005293 @default.
- W4236042998 hasConcept C167781694 @default.
- W4236042998 hasConcept C192562407 @default.
- W4236042998 hasConcept C204530211 @default.
- W4236042998 hasConcept C24326235 @default.
- W4236042998 hasConcept C2779227376 @default.
- W4236042998 hasConcept C31258907 @default.
- W4236042998 hasConcept C41008148 @default.
- W4236042998 hasConcept C43214815 @default.
- W4236042998 hasConcept C62520636 @default.
- W4236042998 hasConcept C68928338 @default.
- W4236042998 hasConcept C78519656 @default.
- W4236042998 hasConcept C79072407 @default.
- W4236042998 hasConcept C97355855 @default.
- W4236042998 hasConceptScore W4236042998C114834414 @default.
- W4236042998 hasConceptScore W4236042998C119599485 @default.
- W4236042998 hasConceptScore W4236042998C120793396 @default.
- W4236042998 hasConceptScore W4236042998C121332964 @default.
- W4236042998 hasConceptScore W4236042998C123745756 @default.
- W4236042998 hasConceptScore W4236042998C126233035 @default.
- W4236042998 hasConceptScore W4236042998C127413603 @default.
- W4236042998 hasConceptScore W4236042998C135402231 @default.
- W4236042998 hasConceptScore W4236042998C137693562 @default.
- W4236042998 hasConceptScore W4236042998C153294291 @default.
- W4236042998 hasConceptScore W4236042998C159985019 @default.
- W4236042998 hasConceptScore W4236042998C163258240 @default.
- W4236042998 hasConceptScore W4236042998C165005293 @default.
- W4236042998 hasConceptScore W4236042998C167781694 @default.
- W4236042998 hasConceptScore W4236042998C192562407 @default.
- W4236042998 hasConceptScore W4236042998C204530211 @default.
- W4236042998 hasConceptScore W4236042998C24326235 @default.
- W4236042998 hasConceptScore W4236042998C2779227376 @default.
- W4236042998 hasConceptScore W4236042998C31258907 @default.
- W4236042998 hasConceptScore W4236042998C41008148 @default.
- W4236042998 hasConceptScore W4236042998C43214815 @default.
- W4236042998 hasConceptScore W4236042998C62520636 @default.
- W4236042998 hasConceptScore W4236042998C68928338 @default.
- W4236042998 hasConceptScore W4236042998C78519656 @default.
- W4236042998 hasConceptScore W4236042998C79072407 @default.
- W4236042998 hasConceptScore W4236042998C97355855 @default.
- W4236042998 hasIssue "4" @default.
- W4236042998 hasLocation W42360429981 @default.
- W4236042998 hasOpenAccess W4236042998 @default.
- W4236042998 hasPrimaryLocation W42360429981 @default.
- W4236042998 hasRelatedWork W1524262400 @default.
- W4236042998 hasRelatedWork W1984329993 @default.
- W4236042998 hasRelatedWork W2004358052 @default.
- W4236042998 hasRelatedWork W2051575093 @default.
- W4236042998 hasRelatedWork W2092336195 @default.
- W4236042998 hasRelatedWork W2122521331 @default.
- W4236042998 hasRelatedWork W2133299332 @default.
- W4236042998 hasRelatedWork W2133333632 @default.
- W4236042998 hasRelatedWork W2138593166 @default.
- W4236042998 hasRelatedWork W2762395239 @default.
- W4236042998 hasVolume "18" @default.
- W4236042998 isParatext "false" @default.
- W4236042998 isRetracted "false" @default.
- W4236042998 workType "article" @default.