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- W4246936714 abstract "The reliability of fine-pitch solder joint interconnection is studied. It consists of two different fine-pitch surface mount components (SMC), namely, the Electronic Industry Associates of Japan (EIAJ) 160-Pin Quad Flat Pack (QFP), and the Joint Electronic Device Engineering Council (JEDEC) 132-Pin Plastic Quad Flat Pack (PQFP). They each have a lead-spacing (from lead-center to lead-center) of approximately 0.025 in. For comparison purposes the conventional JEDEC 68-Pin Plastic Leaded Chip Carrier (PLCC) and the 84-Pin PLCC have also been used in the same manufacturing process. Solder joint reliability of these four SMCs has been quantified for the mechanical shock, mechanical vibration, and thermal environmental stress factors.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W4246936714 date "1990-01-01" @default.
- W4246936714 modified "2023-09-28" @default.
- W4246936714 title "Solder joint reliability of fine pitch surface mount technology assemblies" @default.
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- W4246936714 doi "https://doi.org/10.1109/33.58856" @default.
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